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24LC04BE/ST

Description
512 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8
Categorystorage    storage   
File Size653KB,32 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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24LC04BE/ST Overview

512 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8

24LC04BE/ST Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSOIC
package instructionTSSOP,
Contacts8
Reach Compliance Codecompli
Maximum clock frequency (fCLK)0.4 MHz
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.4 mm
memory density4096 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize512X8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Serial bus typeI2C
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Maximum write cycle time (tWC)5 ms
Base Number Matches1
24AA04/24LC04B
4K I
2
C
Serial EEPROM
Device Selection Table
Part
Number
24AA04
24LC04B
Note 1:
V
CC
Range
1.7-5.5
2.5-5.5
Max. Clock
Frequency
400 kHz
(1)
400 kHz
Temp.
Ranges
I
I, E
Description:
The Microchip Technology Inc. 24AA04/24LC04B
(24XX04*) is a 4 Kbit Electrically Erasable PROM. The
device is organized as two blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V, with standby
and active currents of only 1
μA
and 1 mA,
respectively. The 24XX04 also has a page write
capability for up to 16 bytes of data. The 24XX04 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN, 2x3 TDFN, and MSOP
packages and is also available in the 5-lead SOT-23, or
4-lead Chip Scale package.
100 kHz for V
CC
<2.5V.
Features:
• Single Supply with Operation down to 1.7V for
24AA04 Devices, 2.5V for 24LC04B Devices
• Low-Power CMOS Technology:
- Read current 1 mA, typical
- Standby current 1
μA,
typical
• 2-Wire Serial Interface, I
2
C™ Compatible
• Schmitt Trigger inputs for Noise Suppression
• Output Slope Control to eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 3 ms, typical
• Self-Timed Erase/Write Cycle
• 16-Byte Page Write Buffer
• Hardware Write-Protect
• ESD Protection >4,000V
• More than 1 Million Erase/Write Cycles
• Data Retention >200 Years
• Factory Programming Available
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN, TDFN, MSOP and 5-lead SOT-23 or 4-lead
Chip Scale
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Block Diagram
WP
HV
Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SDA
V
CC
V
SS
SCL
YDEC
Sense Amp.
R/W Control
Package Types
PDIP/MSOP/SOIC/TSSOP
A0
A1
A2
V
SS
Note
1
2
3
4
1:
2:
8
7
6
5
V
CC
WP
SCL
SDA
SCL
Vss
SDA
1
2
3
4
Vcc
SOT-23-5
5
WP
A0 1
A1 2
A2 3
V
SS
4
DFN/TDFN
8 V
CC
7 WP
6 SCL
5 SDA
CS (Chip Scale)
2
V
CC
SCL
1
3
2
4
V
SS
SDA
(Top Down View,
Balls Not Visible)
Pins A0, A1 and A2 are not used by the 24XX04. (No internal connections).
Available in I-temp, “AA” only.
©
2009 Microchip Technology Inc.
DS21708J-page 1

24LC04BE/ST Related Products

24LC04BE/ST 24LC04BE/MNY
Description 512 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 512 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Parts packaging code SOIC DFN
package instruction TSSOP, HVSON,
Contacts 8 8
Reach Compliance Code compli compli
Maximum clock frequency (fCLK) 0.4 MHz 0.4 MHz
JESD-30 code R-PDSO-G8 R-PDSO-N8
JESD-609 code e3 e4
length 4.4 mm 3 mm
memory density 4096 bi 4096 bi
Memory IC Type EEPROM EEPROM
memory width 8 8
Humidity sensitivity level 1 1
Number of functions 1 1
Number of terminals 8 8
word count 512 words 512 words
character code 512 512
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C
organize 512X8 512X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP HVSON
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 0.8 mm
Serial bus type I2C I2C
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.5 V 2.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES YES
technology CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE
Terminal surface MATTE TIN NICKEL PALLADIUM GOLD
Terminal form GULL WING NO LEAD
Terminal pitch 0.65 mm 0.5 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 40 40
width 3 mm 2 mm
Maximum write cycle time (tWC) 5 ms 5 ms
Base Number Matches 1 1

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