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IDT49C403GB

Description
Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,32 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT49C403GB Overview

Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108

IDT49C403GB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codePGA
package instructionCAVITY-UP, PGA-108
Contacts108
Reach Compliance Codenot_compliant
ECCN code3A001.A.2.C
External data bus width32
JESD-30 codeS-CPGA-P108
JESD-609 codee0
length30.48 mm
Number of terminals108
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA108(UNSPEC)
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height5.207 mm
Maximum slew rate275 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width30.48 mm
uPs/uCs/peripheral integrated circuit typeBIT-SLICE MICROPROCESSOR

IDT49C403GB Related Products

IDT49C403GB IDT49C403G IDT49C403AG IDT49C403AGB
Description Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108 Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108 Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108 Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code PGA PGA PGA PGA
package instruction CAVITY-UP, PGA-108 CAVITY-UP, PGA-108 CAVITY-UP, PGA-108 CAVITY-UP, PGA-108
Contacts 108 108 108 108
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
External data bus width 32 32 32 32
JESD-30 code S-CPGA-P108 S-CPGA-P108 S-CPGA-P108 S-CPGA-P108
JESD-609 code e0 e0 e0 e0
length 30.48 mm 30.48 mm 30.48 mm 30.48 mm
Number of terminals 108 108 108 108
Maximum operating temperature 125 °C 70 °C 70 °C 125 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code PGA PGA PGA PGA
Encapsulate equivalent code PGA108(UNSPEC) PGA108(UNSPEC) PGA108(UNSPEC) PGA108(UNSPEC)
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.207 mm 5.207 mm 5.207 mm 5.207 mm
Maximum slew rate 275 mA 250 mA 250 mA 275 mA
Maximum supply voltage 5.5 V 5.25 V 5.25 V 5.5 V
Minimum supply voltage 4.5 V 4.75 V 4.75 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY COMMERCIAL COMMERCIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form PIN/PEG PIN/PEG PIN/PEG PIN/PEG
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 30.48 mm 30.48 mm 30.48 mm 30.48 mm
uPs/uCs/peripheral integrated circuit type BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR
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