|
IDT49C403GB |
IDT49C403G |
IDT49C403AG |
IDT49C403AGB |
| Description |
Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108 |
Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108 |
Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108 |
Bit-Slice Processor, 32-Bit, CMOS, CPGA108, CAVITY-UP, PGA-108 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| Parts packaging code |
PGA |
PGA |
PGA |
PGA |
| package instruction |
CAVITY-UP, PGA-108 |
CAVITY-UP, PGA-108 |
CAVITY-UP, PGA-108 |
CAVITY-UP, PGA-108 |
| Contacts |
108 |
108 |
108 |
108 |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
| External data bus width |
32 |
32 |
32 |
32 |
| JESD-30 code |
S-CPGA-P108 |
S-CPGA-P108 |
S-CPGA-P108 |
S-CPGA-P108 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| length |
30.48 mm |
30.48 mm |
30.48 mm |
30.48 mm |
| Number of terminals |
108 |
108 |
108 |
108 |
| Maximum operating temperature |
125 °C |
70 °C |
70 °C |
125 °C |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
PGA |
PGA |
PGA |
PGA |
| Encapsulate equivalent code |
PGA108(UNSPEC) |
PGA108(UNSPEC) |
PGA108(UNSPEC) |
PGA108(UNSPEC) |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
5.207 mm |
5.207 mm |
5.207 mm |
5.207 mm |
| Maximum slew rate |
275 mA |
250 mA |
250 mA |
275 mA |
| Maximum supply voltage |
5.5 V |
5.25 V |
5.25 V |
5.5 V |
| Minimum supply voltage |
4.5 V |
4.75 V |
4.75 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
NO |
NO |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
COMMERCIAL |
COMMERCIAL |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Terminal location |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
30.48 mm |
30.48 mm |
30.48 mm |
30.48 mm |
| uPs/uCs/peripheral integrated circuit type |
BIT-SLICE MICROPROCESSOR |
BIT-SLICE MICROPROCESSOR |
BIT-SLICE MICROPROCESSOR |
BIT-SLICE MICROPROCESSOR |