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27HC64-55I/K

Description
8K X 8 UVPROM, 55 ns, CQCC32, WINDOWED, CERAMIC, LCC-32
Categorystorage    storage   
File Size246KB,8 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Download Datasheet Parametric View All

27HC64-55I/K Overview

8K X 8 UVPROM, 55 ns, CQCC32, WINDOWED, CERAMIC, LCC-32

27HC64-55I/K Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeQFJ
package instructionWINDOWED, CERAMIC, LCC-32
Contacts32
Reach Compliance Code_compli
ECCN codeEAR99
Maximum access time55 ns
I/O typeCOMMON
JESD-30 codeR-CQCC-N32
JESD-609 codee0
length13.97 mm
memory density65536 bi
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals32
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeWQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER, WINDOW
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12.5 V
Certification statusNot Qualified
Maximum seat height3.302 mm
Maximum standby current0.05 A
Maximum slew rate0.171 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm
Base Number Matches1
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