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TE28F016S3-150

Description
Flash, 2MX8, 150ns, PDSO40, 10 X 20 MM, TSOP-40
Categorystorage    storage   
File Size517KB,37 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

TE28F016S3-150 Overview

Flash, 2MX8, 150ns, PDSO40, 10 X 20 MM, TSOP-40

TE28F016S3-150 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeTSOP
package instructionTSOP1, TSSOP40,.8,20
Contacts40
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time150 ns
Other featuresUSER-SELECTABLE 3.3V OR 12V VPP
command user interfaceYES
Data pollingNO
JESD-30 codeR-PDSO-G40
JESD-609 codee0
length18.4 mm
memory density16777216 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size32
Number of terminals40
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP40,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Programming voltage2.7 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size64K
Maximum standby current0.00002 A
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeNOR TYPE
width10 mm
Base Number Matches1
E
n
n
n
PRODUCT PREVIEW
BYTE-WIDE
SMART 3 FlashFile™ MEMORY FAMILY
4, 8, AND 16 MBIT
28F004S3, 28F008S3, 28F016S3
Includes Commercial and Extended Temperature Specifications
SmartVoltage Technology
Smart 3 Flash: 2.7V (Read-Only) or
3.3V V
CC
and 3.3V or 12V V
PP
High-Performance
120 ns Read Access Time
Enhanced Data Protection Features
Absolute Protection with V
PP
= GND
Flexible Block Locking
Block Write Lockout during Power
Transitions
Enhanced Automated Suspend Options
Program Suspend to Read
Block Erase Suspend to Program
Block Erase Suspend to Read
Industry-Standard Packaging
40-Lead TSOP, 44-Lead PSOP
n
n
n
n
n
n
High-Density 64-Kbyte Symmetrical
Erase Block Architecture
4 Mbit: Eight Blocks
8 Mbit: Sixteen Blocks
16 Mbit: Thirty-Two Blocks
Extended Cycling Capability
100,000 Block Erase Cycles
Low Power Management
Deep Power-Down Mode
Automatic Power Savings Mode
Decreases I
CC
in Static Mode
Automated Program and Block Erase
Command User Interface
Status Register
SRAM-Compatible Write Interface
ETOX™ V Nonvolatile Flash
Technology
n
n
Intel’s byte-wide Smart 3 FlashFile™ memory family renders a variety of density offerings in the same
package. The 4-, 8-, and 16-Mbit byte-wide FlashFile memories provide high-density, low-cost, nonvolatile,
read/write storage solutions for a wide range of applications. Their symmetrically-blocked architecture, flexible
voltage, and extended cycling provide highly flexible components suitable for resident flash arrays, SIMMs,
and memory cards. Enhanced suspend capabilities provide an ideal solution for code or data storage
applications. For secure code storage applications, such as networking, where code is either directly
executed out of flash or downloaded to DRAM, the 4-, 8-, and 16-Mbit FlashFile memories offer three levels
of protection: absolute protection with V
PP
at GND, selective hardware block locking, or flexible software
block locking. These alternatives give designers ultimate control of their code security needs.
This family of products is manufactured on Intel’s 0.4
µm
ETOX™ V process technology. They come in
industry-standard packages: the 40-lead TSOP, ideal for board-constrained applications, and the rugged
44-lead PSOP. Based on the 28F008SA architecture, the byte-wide Smart 3 FlashFile memory family
enables quick and easy upgrades for designs that demand state-of-the-art technology.
June 1997
Order Number: 290598-003

TE28F016S3-150 Related Products

TE28F016S3-150 E28F016S3-120 PA28F016S3-150
Description Flash, 2MX8, 150ns, PDSO40, 10 X 20 MM, TSOP-40 Flash, 2MX8, 120ns, PDSO40, 10 X 20 MM, TSOP-40 Flash, 2MX8, 150ns, PDSO44, 13.30 X 28.20 MM, PLASTIC, SOP-44
Is it Rohs certified? incompatible incompatible incompatible
Parts packaging code TSOP TSOP SOIC
package instruction TSOP1, TSSOP40,.8,20 TSOP1, TSSOP40,.8,20 SOP, SOP44,.63
Contacts 40 40 44
Reach Compliance Code unknow unknow unknow
ECCN code EAR99 EAR99 EAR99
Maximum access time 150 ns 120 ns 150 ns
Other features USER-SELECTABLE 3.3V OR 12V VPP USER-SELECTABLE 3.3V OR 12V VPP USER-SELECTABLE 3.3V OR 12V VPP
command user interface YES YES YES
Data polling NO NO NO
JESD-30 code R-PDSO-G40 R-PDSO-G40 R-PDSO-G44
JESD-609 code e0 e0 e0
length 18.4 mm 18.4 mm 28.2 mm
memory density 16777216 bi 16777216 bi 16777216 bi
Memory IC Type FLASH FLASH FLASH
memory width 8 8 8
Number of functions 1 1 1
Number of departments/size 32 32 32
Number of terminals 40 40 44
word count 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C
organize 2MX8 2MX8 2MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TSOP1 SOP
Encapsulate equivalent code TSSOP40,.8,20 TSSOP40,.8,20 SOP44,.63
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 2.7 V 2.7 V 2.7 V
Certification status Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES
Maximum seat height 1.2 mm 1.2 mm 2.95 mm
Department size 64K 64K 64K
Maximum standby current 0.00002 A 0.00001 A 0.00001 A
Maximum slew rate 0.04 mA 0.04 mA 0.04 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology MOS MOS MOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit NO NO NO
type NOR TYPE NOR TYPE NOR TYPE
width 10 mm 10 mm 13.3 mm
Base Number Matches 1 1 1
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