TMS32C6713BZDPA200 datasheet, PDF

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TMS32C6713BZDPA200: DescriptionFloating-Point Digital Signal Processors 272-BGA; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，154 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TMS32C6713BZDPA200 Overview

Floating-Point Digital Signal Processors 272-BGA

TMS32C6713BZDPA200 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	BGA, BGA272,20X20,50
Contacts	272
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Factory Lead Time	6 weeks
Samacsys Description	Floating-Point Digital Signal Processors
Other features	ALSO OPERATES AT 3.3V SUPPLY
Address bus width	22
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	200 MHz
External data bus width	32
Format	FLOATING POINT
Integrated cache	YES
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B272
JESD-609 code	e1
length	27 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels	16
Number of external interrupt devices	4
Number of terminals	272
Number of timers	2
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA272,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
power supply	1.2,3.3 V
Certification status	Not Qualified
RAM (number of words)	65536
Maximum seat height	2.57 mm
Maximum supply voltage	1.32 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

TMS32C6713BZDPA200 Related Products

	TMS32C6713BZDPA200	TMS320C6713BGDP225	TMS320C6713BGDP300	TMS320C6713BZDP300	TMS320C6713BZDP225	TMS32C6713BPYPA167	TMS32C6713BPYPA200	TMS32C6713BGDPA200
Description	Floating-Point Digital Signal Processors 272-BGA	Floating-Point Digital Signal Processors 272-BGA	Floating-Point Digital Signal Processors 272-BGA	Floating-Point Digital Signal Processors 272-BGA	Floating-Point Digital Signal Processors 272-BGA	Floating-Point Digital Signal Processors 208-HLQFP	Floating-Point Digital Signal Processors 208-HLQFP	Floating-Point Digital Signal Processors 272-BGA
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	BGA	BGA	QFP	QFP	BGA
package instruction	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50	HLFQFP, QFP208,1.2SQ,20	HLFQFP, QFP208,1.2SQ,20	BGA, BGA272,20X20,50
Contacts	272	272	272	272	272	208	208	272
Reach Compliance Code	compliant	_compli	_compli	compli	compli	compliant	compliant	_compli
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Factory Lead Time	6 weeks	6 weeks	1 week	1 week	1 week	1 week	6 weeks	6 weeks
Other features	ALSO OPERATES AT 3.3V SUPPLY	ALSO OPERATES AT 3.3V SUPPLY	ALSO OPERATES AT 3.3V SUPPLY	ALSO OPERATES AT 3.3V SUPPLY	ALSO OPERATES AT 3.3V SUPPLY	ALSO OPERATES AT 3.3V SUPPLY	ALSO OPERATES AT 3.3V SUPPLY	ALSO OPERATES AT 3.3V SUPPLY
Address bus width	22	22	22	22	22	22	22	22
barrel shifter	NO	NO	NO	NO	NO	NO	NO	NO
bit size	32	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	200 MHz	225 MHz	300 MHz	300 MHz	225 MHz	167 MHz	200 MHz	200 MHz
External data bus width	32	32	32	32	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272	S-PQFP-G208	S-PQFP-G208	S-PBGA-B272
JESD-609 code	e1	e0	e0	e1	e1	e4	e4	e0
length	27 mm	27 mm	27 mm	27 mm	27 mm	28 mm	28 mm	27 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3	3	4	4	3
Number of DMA channels	16	16	16	16	16	16	16	16
Number of external interrupt devices	4	4	4	4	4	4	4	4
Number of terminals	272	272	272	272	272	208	208	272
Number of timers	2	2	2	2	2	2	2	2
Maximum operating temperature	105 °C	90 °C	90 °C	90 °C	90 °C	105 °C	105 °C	105 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	HLFQFP	HLFQFP	BGA
Encapsulate equivalent code	BGA272,20X20,50	BGA272,20X20,50	BGA272,20X20,50	BGA272,20X20,50	BGA272,20X20,50	QFP208,1.2SQ,20	QFP208,1.2SQ,20	BGA272,20X20,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	220	220	260	260	260	260	220
power supply	1.2,3.3 V	1.2,3.3 V	1.4,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	65536	65536	65536	65536	65536	65536	65536	65536
Maximum seat height	2.57 mm	2.57 mm	2.57 mm	2.57 mm	2.57 mm	1.6 mm	1.6 mm	2.57 mm
Maximum supply voltage	1.32 V	1.32 V	1.47 V	1.47 V	1.32 V	1.32 V	1.32 V	1.32 V
Minimum supply voltage	1.14 V	1.14 V	1.33 V	1.33 V	1.14 V	1.14 V	1.14 V	1.14 V
Nominal supply voltage	1.2 V	1.2 V	1.4 V	1.4 V	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	OTHER	OTHER	OTHER	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL	BALL	GULL WING	GULL WING	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.5 mm	0.5 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	27 mm	27 mm	27 mm	27 mm	28 mm	28 mm	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1	1	1	1	1	1	1	1
Is it lead-free?	Lead free	-	-	Lead free	Lead free	Lead free	Lead free	-
Is it Rohs certified?	conform to	-	-	conform to	conform to	conform to	conform to	-

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