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PCA9534ADBRG4

Description
Interface - I/O Expanders Remote 8B I2C & Lo- Pwr I/O Expander
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,39 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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PCA9534ADBRG4 Overview

Interface - I/O Expanders Remote 8B I2C & Lo- Pwr I/O Expander

PCA9534ADBRG4 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOIC
package instructionGREEN, PLASTIC, SSOP-16
Contacts16
Reach Compliance Codeunknow
ECCN codeEAR99
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length6.2 mm
Humidity sensitivity level1
Number of digits8
Number of I/O lines8
Number of ports1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP16,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply2.5/5 V
Certification statusNot Qualified
Maximum seat height2 mm
Maximum supply voltage5.5 V
Minimum supply voltage2.3 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width5.3 mm
uPs/uCs/peripheral integrated circuit typePARALLEL IO PORT, GENERAL PURPOSE

PCA9534ADBRG4 Related Products

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Description Interface - I/O Expanders Remote 8B I2C & Lo- Pwr I/O Expander Interface - I/O Expanders Remote 8B I2C & Lo- Pwr I/O Expander Interface - I/O Expanders Remote 8B I2C & Lo- Pwr I/O Expander Interface - I/O Expanders Remote 8B I2C & Lo- Pwr I/O Expander Interface - I/O Expanders Remote 8B I2C & Lo- Pwr I/O Expander Interface - I/O Expanders Remote 8B I2C & Lo- Pwr I/O Expander
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code SOIC SOIC SOIC SOIC TSSOP QFN
package instruction GREEN, PLASTIC, SSOP-16 GREEN, PLASTIC, SSOP-16 TSSOP, TSSOP16,.25,16 GREEN, PLASTIC, SOIC-16 GREEN, PLASTIC, TSSOP-16 GREEN, PLASTIC, QFN-16
Contacts 16 16 16 16 16 16
Reach Compliance Code unknow unknow unknow unknow unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 code R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 S-PQCC-N16
JESD-609 code e4 e4 e4 e4 e4 e4
length 6.2 mm 6.2 mm 4.4 mm 10.3 mm 5 mm 4 mm
Humidity sensitivity level 1 1 1 1 1 2
Number of digits 8 8 8 8 8 8
Number of I/O lines 8 8 8 8 8 8
Number of ports 1 1 1 1 1 1
Number of terminals 16 16 16 16 16 16
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP SSOP TSSOP SOP TSSOP HVQCCN
Encapsulate equivalent code SSOP16,.3 SSOP16,.3 TSSOP16,.25,16 SOP16,.4 TSSOP16,.25 LCC16,.16SQ,25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
power supply 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2 mm 2 mm 1.2 mm 2.65 mm 1.2 mm 1 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING NO LEAD
Terminal pitch 0.65 mm 0.65 mm 0.4 mm 1.27 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 5.3 mm 5.3 mm 3.6 mm 7.5 mm 4.4 mm 4 mm
uPs/uCs/peripheral integrated circuit type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE

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