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74LVC1G3208DCKRE4

Description
Logic Gates Sgl 3Input Pos OR- AND Gate
Categorylogic    logic   
File Size592KB,16 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

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74LVC1G3208DCKRE4 Overview

Logic Gates Sgl 3Input Pos OR- AND Gate

74LVC1G3208DCKRE4 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOIC
package instructionTSSOP, TSSOP6,.08
Contacts6
Reach Compliance Codeunknown
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G6
JESD-609 codee4
length2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeOR-AND GATE
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions1
Number of entries3
Number of terminals6
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP6,.08
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Sup5.9 ns
propagation delay (tpd)17.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width1.25 mm
Base Number Matches1

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Description Logic Gates Sgl 3Input Pos OR- AND Gate Logic Gates Sgl 3Input Pos OR- AND Gate Logic Gates Sgl 3Input Pos OR- AND Gate Logic Gates Sgl 3Input Pos OR- AND Gate Logic Gates Sgl 3Input Pos OR- AND Gate
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code SOIC SOT-23 SOIC SOIC SOIC
package instruction TSSOP, TSSOP6,.08 LSSOP, TSOP6,.11,37 TSSOP, TSSOP6,.08 TSSOP, TSSOP6,.08 TSSOP, TSSOP6,.08
Contacts 6 6 6 6 6
Reach Compliance Code unknown unknow unknow unknow unknow
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6
JESD-609 code e4 e4 e4 e4 e4
length 2 mm 2.9 mm 2 mm 2 mm 2 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type OR-AND GATE OR-AND GATE OR-AND GATE OR-AND GATE OR-AND GATE
MaximumI(ol) 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A
Humidity sensitivity level 1 1 1 1 1
Number of functions 1 1 1 1 1
Number of entries 3 3 3 3 3
Number of terminals 6 6 6 6 6
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP LSSOP TSSOP TSSOP TSSOP
Encapsulate equivalent code TSSOP6,.08 TSOP6,.11,37 TSSOP6,.08 TSSOP6,.08 TSSOP6,.08
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
propagation delay (tpd) 17.5 ns 17.5 ns 17.5 ns 17.5 ns 17.5 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO
Maximum seat height 1.1 mm 1.45 mm 1.1 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.95 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 1.25 mm 1.6 mm 1.25 mm 1.25 mm 1.25 mm
Base Number Matches 1 1 1 1 1
Prop。Delay @ Nom-Su - 5.9 ns 5.9 ns 5.9 ns 5.9 ns

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