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DG129AP/883B

Description
2 CHANNEL, BUF OR INV BASED PRPHL DRVR, CDIP14, CERAMIC, DIP-14
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size137KB,4 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

DG129AP/883B Overview

2 CHANNEL, BUF OR INV BASED PRPHL DRVR, CDIP14, CERAMIC, DIP-14

DG129AP/883B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Parts packaging codeDIP
package instructionCERAMIC, DIP-14
Contacts14
Reach Compliance Codenot_compliant
ECCN codeEAR99
Built-in protectionTRANSIENT
Interface integrated circuit typeBUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 codeR-CDIP-T14
JESD-609 codee0
Nominal negative supply voltage-18 V
Number of functions2
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output current flow directionSOURCE AND SINK
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B
Maximum seat height5.08 mm
Nominal supply voltage12 V
surface mountNO
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Disconnect time1.6 µs
connection time0.6 µs
width7.62 mm

DG129AP/883B Related Products

DG129AP/883B DG129AP
Description 2 CHANNEL, BUF OR INV BASED PRPHL DRVR, CDIP14, CERAMIC, DIP-14 DG129AP
Is it Rohs certified? incompatible incompatible
Parts packaging code DIP DIP
package instruction CERAMIC, DIP-14 CERAMIC, DIP-14
Contacts 14 14
Reach Compliance Code not_compliant not_compliant
JESD-30 code R-CDIP-T14 R-XDIP-T14
JESD-609 code e0 e0
Number of functions 2 2
Number of terminals 14 14
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC
encapsulated code DIP DIP
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
Certification status Not Qualified Not Qualified
surface mount NO NO
Temperature level MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
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