OP400HS-REEL datasheet, PDF - EEWORLD Datasheet

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OP400HS-REEL: DescriptionQUAD OP-AMP, 400000uV OFFSET-MAX, 0.5MHz BAND WIDTH, PDSO16, MS-013AA, SOIC-16; CategoryAnalog mixed-signal IC Amplifier circuit; File Size1MB，17 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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OP400HS-REEL Overview

QUAD OP-AMP, 400000uV OFFSET-MAX, 0.5MHz BAND WIDTH, PDSO16, MS-013AA, SOIC-16

OP400HS-REEL Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	SOIC
package instruction	MS-013AA, SOIC-16
Contacts	16
Reach Compliance Code	unknown
Amplifier type	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	0.02 µA
Nominal Common Mode Rejection Ratio	130 dB
Maximum input offset voltage	400000 µV
JESD-30 code	R-PDSO-G16
JESD-609 code	e0
length	10.3 mm
Humidity sensitivity level	1
Negative supply voltage upper limit	-20 V
Nominal Negative Supply Voltage (Vsup)	-15 V
Number of functions	4
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	240
Maximum seat height	2.65 mm
Nominal slew rate	0.15 V/us
Supply voltage upper limit	20 V
Nominal supply voltage (Vsup)	15 V
surface mount	YES
technology	BIPOLAR
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
Nominal Uniform Gain Bandwidth	500 kHz
width	7.5 mm

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OP400

TABLE OF CONTENTS

Features .............................................................................................. 1

Functional Block Diagrams ............................................................. 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Electrical Characteristics ............................................................. 3

Absolute Maximum Ratings ............................................................ 5

Thermal Resistance ...................................................................... 5

ESD Caution .................................................................................. 5

Data Sheet

Typical Performance Characteristics ..............................................6

Applications..................................................................................... 11

Dual Low Power Instrumentation Amplifier ......................... 11

Bipolar Current Transmitter ..................................................... 12

Differential Output Instrumentation Amplifier .................... 12

Multiple Output Tracking Voltage Reference ......................... 13

Outline Dimensions ....................................................................... 14

Ordering Guide .......................................................................... 15

SMD Parts and Equivalents ...................................................... 15

REVISION HISTORY

1/13—Rev. G to Rev. H

Changes to Features Section and General Description Section........ 1

Changes to Ordering Guide ...........................................................15

2/11—Rev. F to Rev. G

Added S Package to Storage Temperature Range in Table 4 ....... 5

Updated Outline Dimensions ....................................................... 15

12/08—Rev. E to Rev. F

Added New Figure 28, Renumbered Sequentially ..................... 10

Updated Outline Dimensions ....................................................... 15

1/07—Rev. D to Rev. E

Updated Format .................................................................. Universal

Changes to Figure 1 and Figure 2 ................................................... 1

Removed Figure 4 ............................................................................. 4

Changes to Table 3 ............................................................................ 4

Changes to Figure 16 through Figure 19, Figure 21 .................... 8

Changes to Figure 27 ........................................................................ 9

Changes to Figure 28 ...................................................................... 10

Changes to Figure 33 ...................................................................... 13

Updated Outline Dimensions ....................................................... 14

3/06—Rev. C to Rev. D

Updated Format .................................................................. Universal

Deleted Wafer Test Limits Table ..................................................... 4

New Package Drawing: R-14 ......................................................... 15

Updated Outline Dimensions ....................................................... 15

Changes to Ordering Guide .......................................................... 16

6/03—Rev. B to Rev. C

Edits to Specifications .......................................................................2

10/02—Rev. A to Rev. B

Addition of Absolute Maximum Ratings .......................................5

Edits to Outline Dimensions......................................................... 12

4/02—Rev. 0 to Rev. A

Edits to Features.................................................................................1

Edits to Ordering Information ........................................................1

Edits to Pin Connections ..................................................................1

Edits to General Descriptions ..................................................... 1, 2

Edits to Package Type .......................................................................2

Rev. H | Page 2 of 16

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