SPC584Bx
32-bit Power Architecture microcontroller for automotive ASIL-B
applications
Datasheet
-
production data
eTQFP64 (10 x 10 x 1.0 mm)
eTQFP100 (14 x 14 x 1.0 mm)
– Memory Error Management Unit (MEMU)
for collection and reporting of error events
in memories
– Cyclic redundancy check (CRC) unit
Enhanced low power support
– Ultra low power STANDBY
– Smart Wake-up Unit
– Fast wake-up and execute from RAM
Enhanced modular IO subsystem (eMIOS): up
to 64 timed I/O channels with 16-bit counter
resolution
Body cross triggering unit (BCTU)
– Triggers ADC conversions from any eMIOS
channel
– Triggers ADC conversions from up to 2
dedicated PIT_RTIs
Enhanced analog-to-digital converter system
with:
– 2 independent fast 12-bit SAR analog
converters
– 1 supervisor 12-bit SAR analog converter
– 1 10-bit SAR analog converter with STDBY
mode support
Communication interfaces
– 1 Ethernet controller 10/100 Mbps,
compliant IEEE 802.3-2008
– 8 MCAN interfaces with advanced shared
memory scheme and ISO CAN-FD support
– 14 LINFlexD modules
– 7 Deserial Serial Peripheral Interface
(DSPI) modules
Dual phase-locked loops with stable clock
domain for peripherals and FM modulation
domain for computational shell
Nexus Development Interface (NDI) per IEEE-
ISTO 5001-2003 standard, with some support
for 2010 standard
eTQFP144 (20 x 20 x 1.0 mm)
eTQFP176 (24 x 24 x 1.4 mm)
Features
AEC-Q100 qualified
High performance e200z420
– 32-bit Power Architecture technology CPU
– Core frequency as high as 120 MHz
– Variable Length Encoding (VLE)
2112 KB (2048 KB code flash + 64 KB data
flash) on-chip flash memory: supports read
during program and erase operations, and
multiple blocks allowing EEPROM emulation
176 KB HSM dedicated flash memory (144 KB
code + 32 KB data)
128 KB on-chip general-purpose SRAM (in
addition to 64 KB core local data RAM
Crossbar switch architecture for concurrent
access to peripherals, Flash, or RAM from
multiple bus masters with end-to-end ECC
Multi-channel direct memory access controller
(eDMA) with 64 channels
1 interrupt controller (INTC)
Comprehensive new generation ASIL-B safety
concept
– ASIL-B of ISO 26262
– FCCU for collection and reaction to failure
notifications
September 2019
This is information on a product in full production.
DS11701 Rev 4
1/142
www.st.com
SPC584Bx
Boot Assist Flash (BAF) supports factory programming using a serial bootload through the
asynchronous CAN or LIN/UART
Junction temperature range -40 °C to 150 °C
Table 1. Device summary
Part number
Package
1 MB
eTQFP64
eTQFP100
eTQFP144
eLQFP176
SPC584B60E1
SPC584B60E3
SPC584B60E5
SPC584B60E7
1.5 MB
SPC584B64E1
SPC584B64E3
SPC584B64E5
SPC584B64E7
2 MB
SPC584B70E1
SPC584B70E3
SPC584B70E5
SPC584B70E7
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DS11701 Rev 4
SPC584Bx
Contents
Contents
1
2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
2.2
2.3
Device feature summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Features overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3
4
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.3.1
Power domains and power up/down sequencing . . . . . . . . . . . . . . . . . 18
Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Electromagnetic compatibility characteristics . . . . . . . . . . . . . . . . . . . . . . 21
Temperature profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Device consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
I/O pad specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.8.1
4.8.2
4.8.3
I/O input DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
I/O output DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
I/O pad current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.9
4.10
Reset pad (PORST) electrical characteristics . . . . . . . . . . . . . . . . . . . . . 37
PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
4.10.1
4.10.2
PLL0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Crystal oscillator 40 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Crystal Oscillator 32 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
RC oscillator 16 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Low power RC oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
ADC input description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.11
Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.11.1
4.11.2
4.11.3
4.11.4
4.12
ADC system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.12.1
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Contents
4.12.2
4.12.3
SPC584Bx
SAR ADC 12 bit electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . 48
SAR ADC 10 bit electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . 53
4.13
4.14
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
LFAST pad electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.14.1
4.14.2
4.14.3
LFAST interface timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
LFAST LVDS interface electrical characteristics . . . . . . . . . . . . . . . . . . 58
LFAST PLL electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Power management integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Voltage regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Voltage monitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.15
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.15.1
4.15.2
4.15.3
4.16
4.17
Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.17.1
4.17.2
4.17.3
4.17.4
4.17.5
4.17.6
Debug and calibration interface timing . . . . . . . . . . . . . . . . . . . . . . . . . 77
DSPI timing with CMOS pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Ethernet timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
CAN timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
UART timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
I2C timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
5
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
5.1
5.2
5.3
5.4
5.5
eTQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
5.1.1
5.2.1
5.3.1
5.4.1
5.5.1
5.5.2
5.5.3
5.5.4
5.5.5
Package mechanical drawings and data information . . . . . . . . . . . . . 106
Package mechanical drawings and data information . . . . . . . . . . . . . 111
Package mechanical drawings and data information . . . . . . . . . . . . . 116
Package mechanical drawings and data information . . . . . . . . . . . . . 121
eTQFP64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
eTQFP100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
eTQFP144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
LQFP176 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
General notes for specifications at maximum junction temperature . . 125
eTQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
eTQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
eLQFP176 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
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DS11701 Rev 4
SPC584Bx
Contents
6
7
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
DS11701 Rev 4
5/142
5