Operational Amplifier, 1 Func, 7000uV Offset-Max, CDIP8,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Maximum bias current (IIB) at 25C | 0.0001 µA |
| frequency compensation | YES |
| Maximum input offset voltage | 7000 µV |
| JESD-30 code | R-XDIP-T8 |
| JESD-609 code | e0 |
| low-bias | YES |
| low-dissonance | NO |
| Humidity sensitivity level | 2A |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| power supply | +-15/+-20 V |
| Certification status | Not Qualified |
| minimum slew rate | 7.5 V/us |
| Maximum slew rate | 7 mA |
| Supply voltage upper limit | 22 V |
| surface mount | NO |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Minimum voltage gain | 25000 |
| LF156D | LF156AL | LF156AD | LF156AT | UAF356HCQM | UAF156HM | UAF356HC | UAF356HCQR | |
|---|---|---|---|---|---|---|---|---|
| Description | Operational Amplifier, 1 Func, 7000uV Offset-Max, CDIP8, | Operational Amplifier, 1 Func, 2500uV Offset-Max, CQCC20, | Operational Amplifier, 1 Func, 2500uV Offset-Max, CDIP8, | Operational Amplifier, 1 Func, 2500uV Offset-Max, MBCY8, | Operational Amplifier, 1 Func, 13000uV Offset-Max, MBCY8, | Operational Amplifier, 1 Func, 13000uV Offset-Max, MBCY8, | Operational Amplifier, 1 Func, 13000uV Offset-Max, MBCY8, | Operational Amplifier, 1 Func, 13000uV Offset-Max, MBCY8, |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | QLCC | DIP | BCY | BCY | BCY | BCY | BCY |
| package instruction | DIP, DIP8,.3 | QCCN, LCC20,.35SQ | DIP, DIP8,.3 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 |
| Contacts | 8 | 20 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | unknown | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| frequency compensation | YES | YES | YES | YES | YES | YES | YES | YES |
| Maximum input offset voltage | 7000 µV | 2500 µV | 2500 µV | 2500 µV | 13000 µV | 13000 µV | 13000 µV | 13000 µV |
| JESD-30 code | R-XDIP-T8 | S-XQCC-N20 | R-XDIP-T8 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| low-bias | YES | YES | YES | YES | YES | YES | YES | YES |
| low-dissonance | NO | NO | NO | NO | NO | NO | NO | NO |
| Humidity sensitivity level | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 20 | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | - | - |
| Package body material | CERAMIC | CERAMIC | CERAMIC | METAL | METAL | METAL | METAL | METAL |
| Encapsulate equivalent code | DIP8,.3 | LCC20,.35SQ | DIP8,.3 | CAN8,.2 | CAN8,.2 | CAN8,.2 | CAN8,.2 | CAN8,.2 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| power supply | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V | +-15/+-20 V |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | WIRE | WIRE | WIRE | WIRE | WIRE |
| Terminal location | DUAL | QUAD | DUAL | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |