EEPROM, 2KX8, 55ns, Parallel, CMOS, CDIP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| Maximum access time | 55 ns |
| command user interface | NO |
| Data polling | NO |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| memory density | 16384 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Maximum standby current | 0.003 A |
| Maximum slew rate | 0.08 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| switch bit | NO |
| AT28HC291L-55DMB | AT28HC291L-45DMB | AT28HC291L-55LMB | AT28HC291-45LMB | AT28HC291-45DMB | AT28HC291-55LMB | AT28HC291-55DMB | |
|---|---|---|---|---|---|---|---|
| Description | EEPROM, 2KX8, 55ns, Parallel, CMOS, CDIP24, | EEPROM, 2KX8, 45ns, Parallel, CMOS, CDIP24, | EEPROM, 2KX8, 55ns, Parallel, CMOS, CQCC28, | EEPROM, 2KX8, 45ns, Parallel, CMOS, CQCC28, | EEPROM, 2KX8, 45ns, Parallel, CMOS, CDIP24, | EEPROM, 2KX8, 55ns, Parallel, CMOS, CQCC28, | EEPROM, 2KX8, 55ns, Parallel, CMOS, CDIP24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 55 ns | 45 ns | 55 ns | 45 ns | 45 ns | 55 ns | 55 ns |
| command user interface | NO | NO | NO | NO | NO | NO | NO |
| Data polling | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | S-XQCC-N28 | S-XQCC-N28 | R-XDIP-T24 | S-XQCC-N28 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 24 | 24 | 28 | 28 | 24 | 28 | 24 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | QCCN | QCCN | DIP | QCCN | DIP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
| Maximum standby current | 0.003 A | 0.003 A | 0.003 A | 0.06 A | 0.06 A | 0.06 A | 0.06 A |
| Maximum slew rate | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL |
| switch bit | NO | NO | NO | NO | NO | NO | NO |
京公网安备 11010802033920号
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