AT28HC291L-45DMB datasheet, PDF

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AT28HC291L-45DMB: DescriptionEEPROM, 2KX8, 45ns, Parallel, CMOS, CDIP24,; Categorystorage storage; File Size380KB，7 Pages; ManufacturerAtmel (Microchip)

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AT28HC291L-45DMB Overview

EEPROM, 2KX8, 45ns, Parallel, CMOS, CDIP24,

AT28HC291L-45DMB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
Maximum access time	45 ns
command user interface	NO
Data polling	NO
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	EEPROM
memory width	8
Number of terminals	24
word count	2048 words
character code	2000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum standby current	0.003 A
Maximum slew rate	0.08 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
switch bit	NO

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	AT28HC291L-45DMB	AT28HC291L-55DMB	AT28HC291L-55LMB	AT28HC291-45LMB	AT28HC291-45DMB	AT28HC291-55LMB	AT28HC291-55DMB
Description	EEPROM, 2KX8, 45ns, Parallel, CMOS, CDIP24,	EEPROM, 2KX8, 55ns, Parallel, CMOS, CDIP24,	EEPROM, 2KX8, 55ns, Parallel, CMOS, CQCC28,	EEPROM, 2KX8, 45ns, Parallel, CMOS, CQCC28,	EEPROM, 2KX8, 45ns, Parallel, CMOS, CDIP24,	EEPROM, 2KX8, 55ns, Parallel, CMOS, CQCC28,	EEPROM, 2KX8, 55ns, Parallel, CMOS, CDIP24,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	QCCN, LCC28,.45SQ	QCCN, LCC28,.45SQ	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	45 ns	55 ns	55 ns	45 ns	45 ns	55 ns	55 ns
command user interface	NO	NO	NO	NO	NO	NO	NO
Data polling	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-XDIP-T24	R-XDIP-T24	S-XQCC-N28	S-XQCC-N28	R-XDIP-T24	S-XQCC-N28	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8
Number of terminals	24	24	28	28	24	28	24
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	QCCN	QCCN	DIP	QCCN	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	LCC28,.45SQ	LCC28,.45SQ	DIP24,.3	LCC28,.45SQ	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)
Maximum standby current	0.003 A	0.003 A	0.003 A	0.06 A	0.06 A	0.06 A	0.06 A
Maximum slew rate	0.08 mA	0.08 mA	0.08 mA	0.08 mA	0.08 mA	0.08 mA	0.08 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	QUAD	DUAL	QUAD	DUAL
switch bit	NO	NO	NO	NO	NO	NO	NO

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