128KX8 UVPROM, 40 I/O, PIA-GENERAL PURPOSE, CQCC68, WINDOWED, CERAMIC, LDCC-68
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | QFN |
| package instruction | WINDOWED, CERAMIC, LDCC-68 |
| Contacts | 68 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 1.5e-7 ns |
| Other features | GENERAL PURPOSE ZPLD |
| JESD-30 code | S-CQCC-J68 |
| JESD-609 code | e0 |
| length | 24.13 mm |
| Number of I/O lines | 40 |
| Number of ports | 5 |
| Number of terminals | 68 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WQCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, WINDOW |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| ROM size (bits) | 1024 Bits |
| Maximum seat height | 4.57 mm |
| Maximum standby current | 0.00002 A |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| UV erasable | Y |
| width | 24.13 mm |
| uPs/uCs/peripheral integrated circuit type | PARALLEL IO PORT, GENERAL PURPOSE |
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