AP4509GM-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
▼
Simple Drive Requirement
▼
Low On-resistance
D1
D2
D1
D2
N AND P-CHANNEL ENHANCEMENT
MODE POWER MOSFET
N-CH BV
DSS
R
DS(ON)
I
D
G2
S2
G1
30V
14mΩ
10A
-30V
20mΩ
-8.4A
▼
Fast Switching Performance
▼
RoHS Compliant & Halogen-Free
SO-8
S1
P-CH BV
DSS
R
DS(ON)
I
D
Description
AP4509 series are from Advanced Power innovated design
and silicon process technology to achieve the lowest possible
on-resistance and fast switching performance. It provides the
designer with an extreme efficient device for use in a wide
range of power applications.
The SO-8 package is widely preferred for all commercial-
industrial surface mount applications using infrared reflow
technique and suited for voltage conversion or switch
applications.
G1
D1
D2
G2
S1
S2
Absolute Maximum Ratings@T
j
=25
o
C(unless otherwise specified)
Symbol
V
DS
V
GS
I
D
@T
A
=25℃
I
D
@T
A
=70℃
I
DM
P
D
@T
A
=25℃
T
STG
T
J
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current, V
GS
@ 10V
Drain Current, V
GS
@ 10V
Pulsed Drain Current
1
3
3
Rating
N-channel
30
+20
10
7.9
30
2.0
0.016
-55 to 150
-55 to 150
P-channel
-30
+20
-8.4
-6.7
-30
Units
V
V
A
A
A
W
W/℃
℃
℃
Total Power Dissipation
Linear Derating Factor
Storage Temperature Range
Operating Junction Temperature Range
Thermal Data
Symbol
Rthj-a
Parameter
Maximum Thermal Resistance Junction-ambient
3
Value
62.5
Unit
℃/W
1
201501094
Data and specifications subject to change without notice
AP4509GM-HF
N-CH Electrical Characteristics@T
j
=25 C(unless otherwise specified)
Symbol
BV
DSS
R
DS(ON)
Parameter
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
2
Test Conditions
V
GS
=0V, I
D
=250uA
V
GS
=10V, I
D
=9A
V
GS
=4.5V, I
D
=5A
V
GS(th)
g
fs
I
DSS
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
V
DS
=V
GS
, I
D
=250uA
V
DS
=10V, I
D
=9A
V
DS
=30V, V
GS
=0V
V
GS
=+20V, V
DS
=0V
I
D
=9A
V
DS
=24V
V
GS
=4.5V
V
DS
=15V
I
D
=1A
R
G
=3.3Ω
V
GS
=10V
V
GS
=0V
V
DS
=25V
f=1.0MHz
Min.
30
-
-
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ. Max. Units
-
-
-
-
14
-
-
-
23
6
14
14
10
36
17
-
14
20
3
-
10
100
+100
65
-
-
-
-
-
-
V
mΩ
mΩ
V
S
uA
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
o
Drain-Source Leakage Current (T
j
=70
o
C)
V
DS
=24V, V
GS
=0V
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Gate-Source Leakage
Total Gate Charge
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
1770 2830
430
350
-
-
Source-Drain Diode
Symbol
V
SD
t
rr
Q
rr
Parameter
Forward On Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
Test Conditions
I
S
=1.7A, V
GS
=0V
I
S
=9A, V
GS
=0V
dI/dt=100A/µs
Min.
-
-
-
Typ. Max. Units
-
31
25
1.2
-
-
V
ns
nC
2
AP4509GM-HF
P-CH Electrical Characteristics@T
j
=25
o
C(unless otherwise specified)
Symbol
BV
DSS
R
DS(ON)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Parameter
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
o
Test Conditions
V
GS
=0V, I
D
=-250uA
2
Min.
-30
-
-
-1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
-
-
-
14
-
-
-
27
4
18
16
11
40
25
540
450
Max. Units
-
20
30
-3
-
-10
-100
+100
45
-
-
-
-
-
-
-
-
V
mΩ
mΩ
V
S
uA
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
V
GS
=-10V, I
D
=-8A
V
GS
=-4.5V, I
D
=-4A
V
DS
=V
GS
, I
D
=-250uA
V
DS
=-10V, I
D
=-8A
V
DS
=-30V, V
GS
=0V
V
GS
=+20V, V
DS
=0V
I
D
=-8A
V
DS
=-24V
V
GS
=-4.5V
V
DS
=-15V
I
D
=-1A
R
G
=3.3Ω
V
GS
=-10V
V
GS
=0V
V
DS
=-25V
f=1.0MHz
Drain-Source Leakage Current (T
j
=70 C)
V
DS
=-24V, V
GS
=0V
Gate-Source Leakage
Total Gate Charge
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
1580 2530
Source-Drain Diode
Symbol
V
SD
t
rr
Q
rr
Parameter
Forward On Voltage
2
Test Conditions
I
S
=-1.7A, V
GS
=0V
I
S
=-8A, V
GS
=0V
dI/dt=-100A/µs
Min.
-
-
-
Typ.
-
40
32
Max. Units
-1.2
-
-
V
ns
nC
Reverse Recovery Time
Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in
2
copper pad of FR4 board, t <10sec ; 135℃/W when mounted on min. copper pad.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
3
AP4509GM-HF
N-Channel
160
140
T
A
= 25 C
140
o
10V
7.0V
I
D
, Drain Current (A)
120
T
A
= 150
o
C
I
D
, Drain Current (A)
120
10V
7.0V
100
100
80
80
5.0V
4.5V
60
5.0V
4.5V
60
40
40
20
20
V
G
=3.0V
0
0
1
2
3
4
V
G
=3.0V
0
1
2
3
4
0
V
DS
, Drain-to-Source Voltage (V)
V
DS
, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
18
1.6
I
D
=5A
T
A
=25
o
C
15
I
D
=9A
V
G
=10V
1.4
Normalized R
DS(ON)
2
4
6
8
10
R
DS(ON)
(m
Ω
)
1.2
1.0
12
0.8
9
0.6
-50
0
50
100
150
V
GS
, Gate-to-Source Voltage (V)
T
j
, Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
2.5
10
8
6
I
S
(A)
T
j
=150
o
C
4
T
j
=25
o
C
V
GS(th)
(V)
1.2
2.0
1.5
2
0
1.0
0
0.2
0.4
0.6
0.8
1
-50
0
50
100
150
V
SD
, Source-to-Drain Voltage (V)
T
j
, Junction Temperature ( C)
o
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
4
AP4509GM-HF
N-Channel
12
f=1.0MHz
10000
V
GS
, Gate to Source Voltage (V)
I
D
=9A
V
DS
=24V
10
8
6
C (pF)
C
iss
1000
4
C
oss
C
rss
2
0
0
10
20
30
40
50
100
1
5
9
13
17
21
25
29
Q
G
, Total Gate Charge (nC)
V
DS
, Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
100us
10
Normalized Thermal Response (R
thja
)
Duty factor=0.5
0.2
1ms
I
D
(A)
10ms
1
0.1
0.1
0.05
0.02
100ms
1s
0.1
0.01
P
DM
0.01
Single Pulse
t
T
Duty factor = t/T
Peak T
j
= P
DM
x R
thja
+ T
a
R
thja
=135
o
C/W
T
A
=25
o
C
Single Pulse
0.01
0.1
1
10
DC
0.001
100
0.0001
0.001
0.01
0.1
1
10
100
1000
V
DS
, Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
V
DS
90%
V
G
Q
G
4.5V
Q
GS
Q
GD
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Charge
Q
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
5
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