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MT4C2M8E7TG-6

Description
EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, TSOP-28
Categorystorage    storage   
File Size283KB,23 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
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MT4C2M8E7TG-6 Overview

EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, TSOP-28

MT4C2M8E7TG-6 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeTSOP
package instruction0.300 INCH, PLASTIC, TSOP-28
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE WITH EDO
Maximum access time60 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length18.41 mm
memory density16777216 bit
Memory IC TypeEDO DRAM
memory width8
Number of functions1
Number of ports1
Number of terminals28
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP28,.34
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle2048
Maximum seat height1.2 mm
self refreshNO
Maximum standby current0.0005 A
Maximum slew rate0.13 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.67 mm
TECHNOLOGY, INC.
2 MEG x 8
EDO DRAM
MT4LC2M8E7
MT4C2M8E7
DRAM
FEATURES
• Industry-standard x8 pinout, timing, functions and
packages
• State-of-the-art, high-performance, low-power CMOS
silicon-gate process
• Single power supply (+3.3V
±0.3V
or +5V
±10%)
• All inputs, outputs and clocks are TTL-compatible
• Refresh modes: RAS#-ONLY, HIDDEN and CAS#-
BEFORE-RAS# (CBR)
• Optional Self Refresh (S) for low-power data retention
• 11 row, 10 column addresses
• Extended Data-Out (EDO) PAGE MODE access cycle
• 5V-tolerant inputs and I/Os on 3.3V devices
PIN ASSIGNMENT (Top View)
28-Pin SOJ
(DA-3)
V
CC
DQ1
DQ2
DQ3
DQ4
WE#
RAS#
NC
A10
A0
A1
A2
A3
Vcc
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vss
DQ8
DQ7
DQ6
DQ5
CAS#
OE#
A9
A8
A7
A6
A5
A4
Vss
V
CC
DQ1
DQ2
DQ3
DQ4
WE#
RAS#
NC
A10
A0
A1
A2
A3
Vcc
28-Pin SOJ
(DA-4)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vss
DQ8
DQ7
DQ6
DQ5
CAS#
OE#
A9
A8
A7
A6
A5
A4
Vss
OPTIONS
• Voltages
3.3V
5V
• Refresh Addressing
2,048 (i.e. 2K) Rows
• Packages
Plastic SOJ (300 mil)
Plastic SOJ (400 mil)
Plastic TSOP (300 mil)
• Timing
50ns access
60ns access
• Refresh Rates
Standard Refresh
Self Refresh (128ms period)
MARKING
LC
C
E7
DJ
DW
TG
-5
-6
None
S
28-Pin TSOP
(DB-3)
V
CC
DQ1
DQ2
DQ3
DQ4
WE#
RAS#
NC
A10
A0
A1
A2
A3
Vcc
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vss
DQ8
DQ7
DQ6
DQ5
CAS#
OE#
A9
A8
A7
A6
A5
A4
Vss
Note:
The # symbol indicates signal is active LOW.
2 MEG x 8 EDO DRAM PART NUMBERS
PART NUMBER
MT4LC2M8E7DJ
MT4LC2M8E7DJS
MT4LC2M8E7DW
MT4LC2M8E7DWS
MT4LC2M8E7TG
MT4LC2M8E7TGS
MT4C2M8E7DJ
MT4C2M8E7DJS
MT4C2M8E7DW
MT4C2M8E7DWS
MT4C2M8E7TG
MT4C2M8E7TGS
V
CC
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
5V
5V
5V
5V
5V
5V
REFRESH
2K
2K
2K
2K
2K
2K
2K
2K
2K
2K
2K
2K
PACKAGE
300-SOJ
300-SOJ
400-SOJ
400-SOJ
TSOP
TSOP
300-SOJ
300-SOJ
400-SOJ
400-SOJ
TSOP
TSOP
REFRESH
Standard
Self
Standard
Self
Standard
Self
Standard
Self
Standard
Self
Standard
Self
• Part Number Example: MT4LC2M8E7DJ-5
Note:
The 2 Meg x 8 EDO DRAM base number differentiates the offerings in
one place -
MT4LC2M8E7.
The third field distinguishes the low voltage
offering: LC designates V
CC
= 3.3V and C designates V
CC
= 5V.
KEY TIMING PARAMETERS
SPEED
-5
-6
t
RC
t
RAC
t
PC
t
AA
t
CAC
t
CAS
84ns
104ns
50ns
60ns
20ns
25ns
25ns
30ns
13ns
15ns
8ns
10ns
2 Meg x 8 EDO DRAM
D48.pm5 – Rev. 3/97
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©1997,
Micron Technology, Inc.

MT4C2M8E7TG-6 Related Products

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Description EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, TSOP-28 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, TSOP-28 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 EDO DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, TSOP-28
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
Parts packaging code TSOP SOJ TSOP SOJ SOJ SOJ SOJ SOJ TSOP
package instruction 0.300 INCH, PLASTIC, TSOP-28 0.400 INCH, PLASTIC, SOJ-28 0.300 INCH, PLASTIC, TSOP-28 0.400 INCH, PLASTIC, SOJ-28 0.300 INCH, PLASTIC, SOJ-28 0.300 INCH, PLASTIC, SOJ-28 0.300 INCH, PLASTIC, SOJ-28 0.400 INCH, PLASTIC, SOJ-28 0.300 INCH, PLASTIC, TSOP-28
Contacts 28 28 28 28 28 28 28 28 28
Reach Compliance Code unknown not_compliant unknown not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
Maximum access time 60 ns 60 ns 50 ns 50 ns 60 ns 50 ns 50 ns 50 ns 50 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G28 R-PDSO-J28 R-PDSO-G28 R-PDSO-J28 R-PDSO-J28 R-PDSO-J28 R-PDSO-J28 R-PDSO-J28 R-PDSO-G28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 18.41 mm 18.44 mm 18.41 mm 18.44 mm 18.44 mm 18.44 mm 18.44 mm 18.44 mm 18.41 mm
memory density 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
Memory IC Type EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM EDO DRAM
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28 28 28
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8 2MX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 SOJ TSOP2 SOJ SOJ SOJ SOJ SOJ TSOP2
Encapsulate equivalent code TSOP28,.34 SOJ28,.44 TSOP28,.34 SOJ28,.44 SOJ28,.34 SOJ28,.34 SOJ28,.34 SOJ28,.44 TSOP28,.34
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 235 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 3.3 V 5 V 5 V 3.3 V 5 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 2048 2048 2048 2048 2048 2048 2048 2048 2048
Maximum seat height 1.2 mm 3.68 mm 1.2 mm 3.68 mm 3.61 mm 3.61 mm 3.61 mm 3.68 mm 1.2 mm
self refresh NO NO NO NO NO NO NO NO NO
Maximum standby current 0.0005 A 0.0005 A 0.0005 A 0.0005 A 0.0005 A 0.0005 A 0.0005 A 0.0005 A 0.0005 A
Maximum slew rate 0.13 mA 0.13 mA 0.14 mA 0.11 mA 0.13 mA 0.14 mA 0.11 mA 0.14 mA 0.11 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 3.6 V 5.5 V 5.5 V 3.6 V 5.5 V 3.6 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 3 V 4.5 V 4.5 V 3 V 4.5 V 3 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 3.3 V 5 V 5 V 3.3 V 5 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING J BEND GULL WING J BEND J BEND J BEND J BEND J BEND GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.67 mm 10.21 mm 7.67 mm 10.21 mm 7.67 mm 7.67 mm 7.67 mm 10.21 mm 7.67 mm
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