HDMP-2004 datasheet, PDF - EEWORLD Datasheet

HDMP-2004: DescriptionTelecom Circuit, 1-Func, Bipolar, PQFP12, HERMETIC SEALED, SMT-12; CategoryWireless rf/communication Telecom circuit; File Size233KB，11 Pages; ManufacturerHP（Keysight）; Websitehttp://www.semiconductor.agilent.com/

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HDMP-2004 Overview

Telecom Circuit, 1-Func, Bipolar, PQFP12, HERMETIC SEALED, SMT-12

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	HP（Keysight）
Parts packaging code	QFP
package instruction	QFP,
Contacts	12
Reach Compliance Code	unknown
JESD-30 code	S-PQFP-G12
JESD-609 code	e0
length	12.7 mm
Negative supply voltage rating	-5.2 V
Number of functions	1
Number of terminals	12
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Certification status	Not Qualified
Maximum seat height	3.6 mm
surface mount	YES
technology	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	2.54 mm
Terminal location	QUAD
width	12.7 mm

	HDMP-2004	HDMP-2003
Description	Telecom Circuit, 1-Func, Bipolar, PQFP12, HERMETIC SEALED, SMT-12	Telecom Circuit, 1-Func, Bipolar, PQFP12, HERMETIC SEALED, SMT-12
Is it Rohs certified?	incompatible	incompatible
Maker	HP（Keysight）	HP（Keysight）
Parts packaging code	QFP	QFP
package instruction	QFP,	QFP,
Contacts	12	12
Reach Compliance Code	unknown	unknown
JESD-30 code	S-PQFP-G12	S-PQFP-G12
JESD-609 code	e0	e0
length	12.7 mm	12.7 mm
Negative supply voltage rating	-5.2 V	-5.2 V
Number of functions	1	1
Number of terminals	12	12
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP
Package shape	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK
Certification status	Not Qualified	Not Qualified
Maximum seat height	3.6 mm	3.6 mm
surface mount	YES	YES
technology	BIPOLAR	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD
width	12.7 mm	12.7 mm

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