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PM7329-BGI

Description
Support Circuit, 1-Func, CMOS, PBGA352, 35 X 35 MM, 1.45 MM HEIGHT, ROHS COMPLIANT, SBGA-352
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,232 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric Compare View All

PM7329-BGI Overview

Support Circuit, 1-Func, CMOS, PBGA352, 35 X 35 MM, 1.45 MM HEIGHT, ROHS COMPLIANT, SBGA-352

PM7329-BGI Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionLBGA,
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B352
length35 mm
Humidity sensitivity level3
Number of functions1
Number of terminals352
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.67 mm
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width35 mm
PM7329 S/UNI-APEX-LITE
DATASHEET
PMC-2010141
ATM TRAFFIC MANAGER AND SWITCH
PM7329
S
/UNI
-
APEX-LITE
TM
S/UNI-APEX-LITE
ATM/PACKET TRAFFIC MANAGER AND SWITCH
DATASHEET
ISSUE 1: FEBRUARY, 2001
PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE

PM7329-BGI Related Products

PM7329-BGI
Description Support Circuit, 1-Func, CMOS, PBGA352, 35 X 35 MM, 1.45 MM HEIGHT, ROHS COMPLIANT, SBGA-352
Is it Rohs certified? conform to
Maker Microsemi
package instruction LBGA,
Reach Compliance Code compliant
JESD-30 code S-PBGA-B352
length 35 mm
Humidity sensitivity level 3
Number of functions 1
Number of terminals 352
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code LBGA
Package shape SQUARE
Package form GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 260
Certification status Not Qualified
Maximum seat height 1.67 mm
Nominal supply voltage 2.5 V
surface mount YES
technology CMOS
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level INDUSTRIAL
Terminal form BALL
Terminal pitch 1.27 mm
Terminal location BOTTOM
Maximum time at peak reflow temperature 30
width 35 mm

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