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MC74HCT04ADDR2

Description
HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOIC-14
Categorylogic    logic   
File Size100KB,3 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC74HCT04ADDR2 Overview

HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOIC-14

MC74HCT04ADDR2 Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeSOIC
package instructionSOP,
Contacts14
Reach Compliance Codeunknown
seriesHCT
JESD-30 codeR-PDSO-G14
length8.65 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
Number of functions6
Number of entries1
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
propagation delay (tpd)26 ns
Certification statusNot Qualified
Maximum seat height1.75 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width3.9 mm

MC74HCT04ADDR2 Related Products

MC74HCT04ADDR2 MC74HCT04AND MC54HCT04AJD MC74HCT04ADD
Description HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOIC-14 HCT SERIES, HEX 1-INPUT INVERT GATE, PDIP14, PLASTIC, DIP-14 HCT SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14 HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOIC-14
Parts packaging code SOIC DIP DIP SOIC
package instruction SOP, DIP, DIP, DIP14,.3 SOP, SOP14,.25
Contacts 14 14 14 14
Reach Compliance Code unknown unknown unknown unknown
series HCT HCT HCT HCT
JESD-30 code R-PDSO-G14 R-PDIP-T14 R-GDIP-T14 R-PDSO-G14
length 8.65 mm 18.86 mm 19.495 mm 8.65 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type INVERTER INVERTER INVERTER INVERTER
Number of functions 6 6 6 6
Number of entries 1 1 1 1
Number of terminals 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code SOP DIP DIP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE
propagation delay (tpd) 26 ns 26 ns 26 ns 26 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 4.69 mm 5.08 mm 1.75 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO NO YES
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
width 3.9 mm 7.62 mm 7.62 mm 3.9 mm
Maker Motorola ( NXP ) Motorola ( NXP ) - Motorola ( NXP )
Is it lead-free? - Contains lead Contains lead Contains lead
Is it Rohs certified? - incompatible incompatible incompatible
JESD-609 code - e0 e0 e0
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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