SN74LVC07ADGVRE4 datasheet, PDF

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SN74LVC07ADGVRE4: DescriptionBuffers & Line Drivers Hex Buffer/Driver w/Open-Drain Output; Categorylogic logic; File Size818KB，23 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74LVC07ADGVRE4 Overview

Buffers & Line Drivers Hex Buffer/Driver w/Open-Drain Output

SN74LVC07ADGVRE4 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	SOIC
package instruction	TSSOP, TSSOP14,.25
Contacts	14
Reach Compliance Code	compli
series	LVC/LCX/Z
JESD-30 code	R-PDSO-G14
JESD-609 code	e4
length	4.4 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.024 A
Humidity sensitivity level	1
Number of functions	6
Number of entries	1
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	OPEN-DRAIN
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Prop。Delay @ Nom-Su	3.6 ns
propagation delay (tpd)	5.6 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.4 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3.6 mm

SN74LVC07ADGVRE4 Related Products

	SN74LVC07ADGVRE4	SN74LVC07ADGVRG4	SN74LVC07ADTE4	SN74LVC07ANSRE4	SN74LVC07ANSRG4
Description	Buffers & Line Drivers Hex Buffer/Driver w/Open-Drain Output	Buffers & Line Drivers Hex Buffer/Driver w/Open-Drain Output	Buffers & Line Drivers Hex Buffer/Driver w/Open-Drain Output	Buffers & Line Drivers Hex Buffer/Driver w/Open-Drain Output	Buffers & Line Drivers Hex Buffer Driver
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Parts packaging code	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	TSSOP, TSSOP14,.25	TSSOP, TSSOP14,.25	SOP, SOP14,.25	SOP, SOP14,.3	SOP, SOP14,.3
Contacts	14	14	14	14	14
Reach Compliance Code	compli	unknow	unknown	unknow	unknow
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14
JESD-609 code	e4	e4	e4	e4	e4
length	4.4 mm	4.4 mm	8.65 mm	10.2 mm	10.2 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
MaximumI(ol)	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A
Humidity sensitivity level	1	1	1	1	1
Number of functions	6	6	6	6	6
Number of entries	1	1	1	1	1
Number of terminals	14	14	14	14	14
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	TSSOP	SOP	SOP	SOP
Encapsulate equivalent code	TSSOP14,.25	TSSOP14,.25	SOP14,.25	SOP14,.3	SOP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
method of packing	TR	TR	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
propagation delay (tpd)	5.6 ns	5.6 ns	5.6 ns	5.6 ns	5.6 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO
Maximum seat height	1.2 mm	1.2 mm	1.75 mm	2 mm	2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.4 mm	0.4 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	3.6 mm	3.6 mm	3.9 mm	5.3 mm	5.3 mm
Maker	Texas Instruments	Texas Instruments	Texas Instruments	-	-
Prop。Delay @ Nom-Su	3.6 ns	3.6 ns	-	3.6 ns	3.6 ns
Base Number Matches	-	-	1	1	1

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