M24C04-DS3 datasheet, PDF - EEWORLD Datasheet

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M24C04-DS3: Description512X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 X 3 MM, TSSOP-8; Categorystorage storage; File Size185KB，29 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M24C04-DS3 Overview

512X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 X 3 MM, TSSOP-8

M24C04-DS3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	3 X 3 MM, TSSOP-8
Contacts	8
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	0.4 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDMR
JESD-30 code	S-PDSO-G8
JESD-609 code	e0
length	3 mm
memory density	4096 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	512X8
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP8,.19
Package shape	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Filter level	AEC-Q100
Maximum seat height	1.1 mm
Serial bus type	I2C
Maximum standby current	0.000005 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3 mm
Maximum write cycle time (tWC)	10 ms
write protect	HARDWARE

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M24C16, M24C08

M24C04, M24C02, M24C01

16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit Serial I²C Bus EEPROM

FEATURES SUMMARY

■

Two Wire I

C Serial Interface

Supports 400kHz Protocol

Single Supply Voltage:

– 4.5 to 5.5V for M24Cxx

– 2.5 to 5.5V for M24Cxx-W

– 1.8 to 5.5V for M24Cxx-R

Write Control Input

BYTE and PAGE WRITE (up to 16 Bytes)

RANDOM and SEQUENTIAL READ Modes

Self-Timed Programming Cycle

Automatic Address Incrementing

Enhanced ESD/Latch-Up Behavior

More than 1 Million Erase/Write Cycles

More than 40 Year Data Retention

Figure 1. Packages

PDIP8 (BN)

SO8 (MN)

150 mil width

TSSOP8 (DW)

169 mil width

TSSOP8 (DS)

3x3mm² body size (MSOP)

UFDFPN8 (MB)

2x3mm² (MLP)

March 2004

1/29

M24C16, M24C08, M24C04, M24C02, M24C01

TABLE OF CONTENTS

FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Power On Reset: VCC Lock-Out Write Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Figure 3. DIP, SO, TSSOP and MLP Connections (Top View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 4. Maximum RL Value versus Bus Capacitance (CBUS) for an I2C Bus . . . . . . . . . .

Figure 5. I2C Bus Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Table 2. Device Select Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

.....5

.....6

DEVICE OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Start Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Acknowledge Bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Memory Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 3. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 6. Write Mode Sequences with WC=1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 7. Write Mode Sequences with WC=0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 9

Figure 8. Write Cycle Polling Flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Minimizing System Delays by Polling On ACK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 9. Read Mode Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Sequential Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Acknowledge in Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2/29

M24C16, M24C08, M24C04, M24C02, M24C01

DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 5. Operating Conditions (M24Cxx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 6. Operating Conditions (M24Cxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 7. Operating Conditions (M24Cxx-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 8. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 10.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 9. Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 10. DC Characteristics (M24Cxx, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 11. DC Characteristics (M24Cxx, Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 12. DC Characteristics (M24Cxx-W, Device Grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 13. DC Characteristics (M24Cxx-W, Device Grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 14. DC Characteristics (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 15. AC Characteristics (M24Cxx, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 16. AC Characteristics (M24Cxx, Device Grade 3; M24Cxx-W, Device Grade 6 or 3) . . . . . 18

Table 17. AC Characteristics (M24Cxx-R). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 11.AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 12.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 21

Table 18. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data . . . . . . . . . . 21

Figure 13.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 22

Table 19. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data

Figure 14.UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline

Table 20. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data .

Figure 15.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 24

Table 21. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . . 24

Figure 16.TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline

Table 22. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Table 23. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Table 24. How to Identify Current and New Products by the Process Identification Letter . . . . . . . 27

REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Table 25. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3/29

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