Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | 0.003 µA |
| Maximum bias current (IIB) at 25C | 0.002 µA |
| Nominal Common Mode Rejection Ratio | 85 dB |
| frequency compensation | YES |
| Maximum input offset voltage | 3000 µV |
| JESD-30 code | R-CDIP-T14 |
| JESD-609 code | e0 |
| length | 19.431 mm |
| low-dissonance | NO |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of functions | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-5/+-20 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class C |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 0.6 mA |
| Supply voltage upper limit | 20 V |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Minimum voltage gain | 25000 |
| width | 7.62 mm |

| LM112D | LM212D | LD112 | LM112F | LM312D | LD312 | |
|---|---|---|---|---|---|---|
| Description | Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, 0.062 X 0.072 INCH, DIE-8 | Operational Amplifier, 1 Func, 3000uV Offset-Max, BIPolar, CDFP10, HERMETIC SEALED, CERPACK-10 | Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, 0.062 X 0.072 INCH, DIE-8 |
| Parts packaging code | DIP | DIP | DIE | DFP | DIP | DIE |
| package instruction | DIP, DIP14,.3 | HERMETIC SEALED, DIP-14 | DIE, DIE OR CHIP | DFP, FL10,.3 | DIP, DIP14,.3 | DIE, DIE OR CHIP |
| Contacts | 14 | 14 | 8 | 10 | 14 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | 0.003 µA | 0.003 µA | 0.003 µA | 0.003 µA | 0.01 µA | 0.01 µA |
| Nominal Common Mode Rejection Ratio | 85 dB | 85 dB | 85 dB | 85 dB | 80 dB | 80 dB |
| frequency compensation | YES | YES | YES | YES | YES | YES |
| Maximum input offset voltage | 3000 µV | 3000 µV | 3000 µV | 3000 µV | 10000 µV | 10000 µV |
| JESD-30 code | R-CDIP-T14 | R-CDIP-T14 | R-XUUC-N8 | R-CDFP-F10 | R-CDIP-T14 | R-XUUC-N8 |
| low-dissonance | NO | NO | NO | NO | NO | NO |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 14 | 14 | 8 | 10 | 14 | 8 |
| Maximum operating temperature | 125 °C | 85 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -25 °C | -55 °C | -55 °C | - | - |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| encapsulated code | DIP | DIP | DIE | DFP | DIP | DIE |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIE OR CHIP | FL10,.3 | DIP14,.3 | DIE OR CHIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | UNCASED CHIP | FLATPACK | IN-LINE | UNCASED CHIP |
| power supply | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | +-5/+-15 V | +-5/+-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA | 0.8 mA | 0.8 mA |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | NO | YES | YES | NO | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | OTHER | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD |
| Terminal location | DUAL | DUAL | UPPER | DUAL | DUAL | UPPER |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible | - |
| Maker | AMD | - | AMD | AMD | AMD | AMD |
| Maximum bias current (IIB) at 25C | 0.002 µA | 0.002 µA | - | 0.002 µA | 0.007 µA | - |
| JESD-609 code | e0 | e0 | - | e0 | e0 | - |
| length | 19.431 mm | 19.431 mm | - | 6.1595 mm | 19.431 mm | - |
| Maximum seat height | 5.08 mm | 5.08 mm | - | 2.032 mm | 5.08 mm | - |
| Supply voltage upper limit | 20 V | 20 V | - | 20 V | 20 V | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal pitch | 2.54 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | - |
| Minimum voltage gain | 25000 | 25000 | - | 25000 | 15000 | - |
| width | 7.62 mm | 7.62 mm | - | 6.35 mm | 7.62 mm | - |