NS32132E6 datasheet, PDF - EEWORLD Datasheet

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NS32132E6: DescriptionIC,MICROPROCESSOR,32-BIT,MOS,LLCC,68PIN,CERAMIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，70 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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NS32132E6 Overview

IC,MICROPROCESSOR,32-BIT,MOS,LLCC,68PIN,CERAMIC

NS32132E6 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	QCCN, LCC68,.95SQ
Reach Compliance Code	unknown
bit size	32
JESD-30 code	S-XQCC-N68
JESD-609 code	e0
Number of terminals	68
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC68,.95SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Certification status	Not Qualified
speed	6 MHz
Maximum slew rate	300 mA
surface mount	YES
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

NS32132E6 Related Products

	NS32132E6	NS32132E10	NS32132E8	NS32132V10	NS32132V6	NS32132V8
Description	IC,MICROPROCESSOR,32-BIT,MOS,LLCC,68PIN,CERAMIC	IC,MICROPROCESSOR,32-BIT,MOS,LLCC,68PIN,CERAMIC	IC,MICROPROCESSOR,32-BIT,MOS,LLCC,68PIN,CERAMIC	IC,MICROPROCESSOR,32-BIT,MOS,LDCC,68PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,MOS,LDCC,68PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,MOS,LDCC,68PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	QCCN, LCC68,.95SQ	QCCN, LCC68,.95SQ	QCCN, LCC68,.95SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ	QCCJ, LDCC68,1.0SQ
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
bit size	32	32	32	32	32	32
JESD-30 code	S-XQCC-N68	S-XQCC-N68	S-XQCC-N68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	68	68	68	68	68	68
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCN	QCCN	QCCN	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LCC68,.95SQ	LCC68,.95SQ	LCC68,.95SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	6 MHz	10 MHz	8 MHz	10 MHz	6 MHz	8 MHz
Maximum slew rate	300 mA	300 mA	300 mA	300 mA	300 mA	300 mA
surface mount	YES	YES	YES	YES	YES	YES
technology	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	NO LEAD	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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