IC,MICROPROCESSOR,32-BIT,MOS,LDCC,68PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown |
| bit size | 32 |
| JESD-30 code | S-PQCC-J68 |
| JESD-609 code | e0 |
| Number of terminals | 68 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Certification status | Not Qualified |
| speed | 6 MHz |
| Maximum slew rate | 300 mA |
| surface mount | YES |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| NS32132V6 | NS32132E10 | NS32132E6 | NS32132E8 | NS32132V10 | NS32132V8 | |
|---|---|---|---|---|---|---|
| Description | IC,MICROPROCESSOR,32-BIT,MOS,LDCC,68PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,MOS,LLCC,68PIN,CERAMIC | IC,MICROPROCESSOR,32-BIT,MOS,LLCC,68PIN,CERAMIC | IC,MICROPROCESSOR,32-BIT,MOS,LLCC,68PIN,CERAMIC | IC,MICROPROCESSOR,32-BIT,MOS,LDCC,68PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,MOS,LDCC,68PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | QCCJ, LDCC68,1.0SQ | QCCN, LCC68,.95SQ | QCCN, LCC68,.95SQ | QCCN, LCC68,.95SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 32 | 32 | 32 | 32 | 32 | 32 |
| JESD-30 code | S-PQCC-J68 | S-XQCC-N68 | S-XQCC-N68 | S-XQCC-N68 | S-PQCC-J68 | S-PQCC-J68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCN | QCCN | QCCN | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ | LCC68,.95SQ | LCC68,.95SQ | LCC68,.95SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| speed | 6 MHz | 10 MHz | 6 MHz | 8 MHz | 10 MHz | 8 MHz |
| Maximum slew rate | 300 mA | 300 mA | 300 mA | 300 mA | 300 mA | 300 mA |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | MOS | MOS | MOS | MOS | MOS | MOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | NO LEAD | NO LEAD | NO LEAD | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
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