BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
289 & 290 SERIES
Standard
P/N
Low-Cost Single or Dual Package Heat Sinks
Horizontal Mounting
Maximum Footing
in. (mm)
1.000 (25.4) x 0.710 (18.1)
1.000 (25.4) x 0.710 (18.1)
1.000 (25.4) x 1.180 (30.0)
1.000 (25.4) x 1.180 (30.0)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
50°C @ 2W
50°C @ 2W
44°C @ 2W
44°C @ 2W
TO-218, TO-202, TO-220
Height Above
PC Board
in. (mm)
Weight
lbs. (grams)
0.0055 (2.49)
0.0055 (2.49)
0.0082 (3.72)
0.0081 (3.67)
289-AB
0.500 (12.7)
289-AP
0.500 (12.7)
290-1AB
0.500 (12.7)
290-2AB
0.500 (12.7)
Material: Aluminum, Black Anodized
9.0 C/W @ 400 LFM
9.0 C/W @ 400 LFM
7.0 C/W @ 400 LFM
7.0 C/W @ 400 LFM
Low in cost and compact in overall dimensions, one 289 Series heat sink can
accommodate one semiconductor; the 289 Series is available with a black an-
289 SERIES
odized finish (289-AB) or with no finish (289-AP). Two semiconductors can be
mounted to the 290-2AB style.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
290 SERIES
Dimensions: in. (mm)
2
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