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82S181/B3A

Description
IC 1K X 8 OTPROM, 90 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM
Categorystorage    storage   
File Size74KB,4 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

82S181/B3A Overview

IC 1K X 8 OTPROM, 90 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM

82S181/B3A Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeQLCC
package instructionQCCN,
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time90 ns
JESD-30 codeS-CQCC-N28
length11.43 mm
memory density8192 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals28
word count1024 words
character code1000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize1KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.905 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyBIPOLAR
Temperature levelMILITARY
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width11.43 mm

82S181/B3A Related Products

82S181/B3A 82S181/BJA 82S181/BKA
Description IC 1K X 8 OTPROM, 90 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM IC 1K X 8 OTPROM, 90 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM IC 1K X 8 OTPROM, 90 ns, CDFP24, CERAMIC, FP-24, Programmable ROM
Maker NXP NXP NXP
Parts packaging code QLCC DIP DFP
package instruction QCCN, DIP, DFP,
Contacts 28 24 24
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
Maximum access time 90 ns 90 ns 90 ns
JESD-30 code S-CQCC-N28 R-GDIP-T24 R-CDFP-F24
memory density 8192 bit 8192 bit 8192 bit
Memory IC Type OTP ROM OTP ROM OTP ROM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 28 24 24
word count 1024 words 1024 words 1024 words
character code 1000 1000 1000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
organize 1KX8 1KX8 1KX8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN DIP DFP
Package shape SQUARE RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.905 mm 5.715 mm 2.286 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES NO YES
technology BIPOLAR BIPOLAR BIPOLAR
Temperature level MILITARY MILITARY MILITARY
Terminal form NO LEAD THROUGH-HOLE FLAT
Terminal pitch 1.27 mm 2.54 mm 1.27 mm
Terminal location QUAD DUAL DUAL
width 11.43 mm 15.24 mm 9.144 mm
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