Powering Communications and Technology
QES SERIES
66 WATT
DESCRIPTION
QES single output DC/DC converters provide up to 66
Watts of output power in an industry standard, quarter-
brick package. The QES converters feature open-frame
packaging, along with planar magnetics and a high
efficiency topology to provide maximum useable power
with minimal thermal constraints. The QES is suited to
telecom, networking, and industrial applications, and is
fully compatible with production board washing processes.
Efficiency vs. Load (48V Input)
FEATURES
• Industry Standard
• Wide Range Input
Package
Voltage
• 100°C Case Operation • 1500V Isolation
• Optional Trim and
• Short Circuit Protection
Enable
95
90
85
80
EFFICIENCY %
75
70
65
60
55
50
45
OES021ZC-A
OES025ZD-A
OES033ZE-A
OES040ZG-A
TECHNICAL SPECIFICATIONS
Input
Voltage Range
24 VDC Nominal
48 VDC Nominal
Input Reverse Input Current
18 - 36 VDC
36 - 75 VDC
Shunt Diode
40
1
2
3
4
5
6
7
8
9
10
X10 = LOAD %
General
Turn-On Time
Remote Shutdown
Remote Shutdown Reference
Switching Frequency
Isolation
Input - Output
Input - Case
Output - Case
Temperature Coefficient
Case Temperature
Operating Range
Storage Range
Thermal Shutdown Range
Vibration, 3 Axes, 5 Min Each
MTBF† (Bellcore TR-NWT-000332)
Safety
Weight (Approx.)
30 ms
Positive or Negative Logic
Vin Negative
300 kHz
1500 VDC
1050 VDC
1050 VDC
±0.02%/°C
-40 To +100°C
-40 To +125°C
105 to 115°C
5 g, 10 - 55 Hz
2.5 X
106 hrs
UL, cUL, TUV
1.7 oz
Output
Setpoint Accuracy
Line Regulation Vin Min. - Vin Max., Iout Rated
Load Regulation Iout Min. - Iout Max., Vin Nom.
Remote Sense Headroom
±1%
0.2% Vout
0.5% Vout
0.5 VDC
10 %, Iout Rated
4% Vout
500 mS
±10%
Shutdown
High Density - Board Mounted Power Division
Minimum Output Current
Dynamic Regulation, Loadstep 25% Iout
Pk Deviation
Settling Time
Voltage Trim Range
Short Circuit And Overcurrent Protection
Short Circuit Current Limit
200% Iout
Current Limit Threshold Range, % of Iout Rated
110 - 140%
OVP Trip Range
115 - 140% Vout Nom.
UVP Trip Range
OVP/UVP Type
70 - 90% Vout Nom.
Latching
Notes
† MTBF predictions may vary slightly from model to model.
Specifications typically at 25°C, normal line, and full load,
unlessotherwise stated.
Soldering Conditions: I/O pins, 260°C, ten seconds; fully
compatible with commercial wave-soldering equipment.
Safety: Agency approvals may vary from model to model.
Please consult factory for specific model information.
Units are water-washable and fully compatible with commercial
spray or immersion post wave-solder washing equipment.
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Powering Communications and Technology
MODELS - (See the last page of Section for options.)
Selection Chart
Model
QES050YE-A
QES066YE-A
QES036ZB-A
QES038ZD-A
QES050ZD-A
QES050ZE-A
QES066ZE-A
Vin
(Volts)
24
24
48
48
48
48
48
Vin Range
(Volts)
18 - 36
18 - 36
36 - 75
36 - 75
36 - 75
36 - 75
36 - 75
Iin Max.*
(Amps)
3.3
4.4
1.4
1.4
1.8
1.6
2.2
Vout
(Volts)
3.3
3.3
1.8
2.5
2.5
3.3
3.3
QES SERIES
66 WATT
Iout Rated
(Amps)
15
20
20
15
20
15
20
Ripple & Noise
Pk-Pk (mV)
100
100
75
100
100
100
100
Efficiency
Typ. **
85%
85%
76%
85%
83%
86%
86%
* Maximum input current at minimum input voltage, maximum rated output power.
** At nominal Vin, rated output.
-0.14"
(-3.6mm)
0
MOUNTING INSERTS
M3X0.5 THROUGH 2PL
2.010"
(51.1mm)
MECHANICAL DRAWING
1
1.45"
(36.8mm)
2
3
0.895"(22.7mm)
4
5
6
7
8
0.600"(15.2mm)
0.450"(11.4mm)
0.300"(7.6mm)
0.150"(3.8mm)
0
-0.295"(-7.5mm)
-0.425"(-10.8mm)
-0.010"
(-0.3mm)
2.000"
(50.8mm)
BOTTOM VIEW
2.28"
(57.9mm)
DIA 0.040"
(1.0mm)
DIA 0.062"
(1.6mm)
High Density - Board Mounted Power Division
0.18"(4.6mm)
0.50"
(12.7mm)
Thermal Impedance
Natural Convection 10.1 °C/W
100 LFM
8.0 °C/W
200 LFM
5.4 °C/W
300 LFM
4.4 °C/W
400 LFM
3.4 °C/W
Pin
1
2
3
4
5
6
7
8
Function
-Vin
On/Off
+Vin
-Vout
-Sense
Trim
+Sense
+Vout
Tolerances
Inches:
.XX ± 0.020
.XXX ± 0.010
Pin:
± 0.002
(Millimeters)
.X ± 0.5
.XX ± 0.25
± 0.05
Note:
Thermal impedance data is
dependent on many environmental
factors. The exact thermal
performance should be validated
for specific application.
(Dimensions as listed unless
otherwise specified.)
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OPTIONS
Powering Communications and Technology
When ordering equipment options, use the following suffix information. Select the option(s) that you prefer and
add them to the model number. Example ordering options are located below the options table.
OPTIONS
Negative Logic
SUFFIX
N
APPLICABLE SERIES
HAS, HBD, HBS, HES, HLS, LES,
QBS, QES, QLS, TES, TQD
HAS, HBD, HBS, HES, HLS, QBS, QES,
QLS
XWS, XWD, XWT
IAS, LES
IAD, IAS, LES, SMS
IAS, LES
SMS
Encapsulated EWS, IWS, OWS
Standard Pin Length is 0.180"
(4.6mm)
8
9
1H
1V
2H
2V
3H
3V
All Units (Except SMS)
All Units (Except SMS)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
REMARKS
TTL "Low" Turns Module ON
TTL "High" Turns Module OFF
Lucent Compatible Trim
Terminal Strip
Trim
Enable
Trim and Enable
Current Share
Headerless
PIN LENGTH AND HEATSINK
OPTIONS
0.110" (2.8mm) Pin Length
0.150" (3.8mm) Pin Length
0.24" (6.1mm) Horizontal Heatsink
0.24" (6.1mm) Vertical Heatsink
0.45" (11.4mm) Horizontal Heatsink
0.45" (11.4mm) Vertical Heatsink
0.95" (24.1mm) Horizontal Heatsink
0.95" (24.1mm) Vertical Heatsink
T
TS
1
2
3
4
Y
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
High Density - Board Mounted Power Division
Includes Thermal Pad
Example Options:
HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent compatible trim, and 0.95” vertical heatsink.
LES015YJ-3N = LES015YJ with optional trim and enable, negative logic.
QBS066ZG-AT8 = QBS066ZG-A with Lucent compatible trim and 0.110” pin length.
NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not authorized for use as critical components in life support systems, equipment used
in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the date manu-
factured. Specifications are subject to change without notice.
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Microcontroller MCU
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