ATV750-40FC datasheet, PDF - EEWORLD Datasheet

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ATV750-40FC: DescriptionOT PLD, 40ns, 10-Cell, CMOS, CDFP24; CategoryProgrammable logic devices Programmable logic; File Size1MB，15 Pages; ManufacturerAtmel (Microchip)

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ATV750-40FC Overview

OT PLD, 40ns, 10-Cell, CMOS, CDFP24

ATV750-40FC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
package instruction	DFP, FL24,.4
Reach Compliance Code	unknown
Other features	NO
In-system programmable	NO
JESD-30 code	R-XDFP-F24
JESD-609 code	e0
JTAG BST	NO
Number of macro cells	10
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL24,.4
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Programmable logic type	OT PLD
propagation delay	40 ns
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL

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ATV750-40FC Related Products

	ATV750-40FC	ATV750-40LC	ATV750-40YC	ATV750-40PC	ATV750-40NC	ATV750-40DC	ATV750-40GC	ATV750-40JC	ATV750-40KC
Description	OT PLD, 40ns, 10-Cell, CMOS, CDFP24	UV PLD, 40ns, 10-Cell, CMOS, CQCC28,	UV PLD, 40ns, 10-Cell, CMOS, CDFP24	OT PLD, 40ns, 10-Cell, CMOS, PDIP24,	OT PLD, 40ns, 10-Cell, CMOS, CQCC28,	UV PLD, 40ns, 10-Cell, CMOS, CDIP24,	OT PLD, 40ns, 10-Cell, CMOS, CDIP24,	OT PLD, 40ns, 10-Cell, CMOS, PQCC28,	UV PLD, 40ns, 10-Cell, CMOS, CQCC28,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL24,.4	QCCN, LCC28,.45SQ	DFP, FL24,.4	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DIP, DIP24,.3	DIP, DIP24,.3	QCCJ, LDCC28,.5SQ	QCCJ, LDCC28,.5SQ
Reach Compliance Code	unknown	unknown	unknown	compliant	unknown	unknown	unknown	compliant	unknown
Other features	NO	NO	NO	NO	NO	NO	NO	NO	NO
In-system programmable	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-XDFP-F24	S-XQCC-N28	R-XDFP-F24	R-PDIP-T24	S-XQCC-N28	R-XDIP-T24	R-XDIP-T24	S-PQCC-J28	S-XQCC-J28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
JTAG BST	NO	NO	NO	NO	NO	NO	NO	NO	NO
Number of macro cells	10	10	10	10	10	10	10	10	10
Number of terminals	24	28	24	24	28	24	24	28	28
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DFP	QCCN	DFP	DIP	QCCN	DIP	DIP	QCCJ	QCCJ
Encapsulate equivalent code	FL24,.4	LCC28,.45SQ	FL24,.4	DIP24,.3	LCC28,.45SQ	DIP24,.3	DIP24,.3	LDCC28,.5SQ	LDCC28,.5SQ
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	FLATPACK	CHIP CARRIER	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Programmable logic type	OT PLD	UV PLD	UV PLD	OT PLD	OT PLD	UV PLD	OT PLD	OT PLD	UV PLD
propagation delay	40 ns	40 ns	40 ns	40 ns	40 ns	40 ns	40 ns	40 ns	40 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	YES	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	NO LEAD	FLAT	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	QUAD
Maker	Atmel (Microchip)	-	-	-	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)

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