OT PLD, 40ns, 10-Cell, CMOS, CDIP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| Other features | NO |
| In-system programmable | NO |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| JTAG BST | NO |
| Number of macro cells | 10 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Programmable logic type | OT PLD |
| propagation delay | 40 ns |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| ATV750-40GC | ATV750-40LC | ATV750-40YC | ATV750-40PC | ATV750-40NC | ATV750-40DC | ATV750-40FC | ATV750-40JC | ATV750-40KC | |
|---|---|---|---|---|---|---|---|---|---|
| Description | OT PLD, 40ns, 10-Cell, CMOS, CDIP24, | UV PLD, 40ns, 10-Cell, CMOS, CQCC28, | UV PLD, 40ns, 10-Cell, CMOS, CDFP24 | OT PLD, 40ns, 10-Cell, CMOS, PDIP24, | OT PLD, 40ns, 10-Cell, CMOS, CQCC28, | UV PLD, 40ns, 10-Cell, CMOS, CDIP24, | OT PLD, 40ns, 10-Cell, CMOS, CDFP24 | OT PLD, 40ns, 10-Cell, CMOS, PQCC28, | UV PLD, 40ns, 10-Cell, CMOS, CQCC28, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DFP, FL24,.4 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DFP, FL24,.4 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | unknown | unknown | compliant | unknown |
| Other features | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| In-system programmable | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 code | R-XDIP-T24 | S-XQCC-N28 | R-XDFP-F24 | R-PDIP-T24 | S-XQCC-N28 | R-XDIP-T24 | R-XDFP-F24 | S-PQCC-J28 | S-XQCC-J28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| JTAG BST | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Number of macro cells | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| Number of terminals | 24 | 28 | 24 | 24 | 28 | 24 | 24 | 28 | 28 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | QCCN | DFP | DIP | QCCN | DIP | DFP | QCCJ | QCCJ |
| Encapsulate equivalent code | DIP24,.3 | LCC28,.45SQ | FL24,.4 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | FL24,.4 | LDCC28,.5SQ | LDCC28,.5SQ |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programmable logic type | OT PLD | UV PLD | UV PLD | OT PLD | OT PLD | UV PLD | OT PLD | OT PLD | UV PLD |
| propagation delay | 40 ns | 40 ns | 40 ns | 40 ns | 40 ns | 40 ns | 40 ns | 40 ns | 40 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | YES | NO | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD | QUAD |
| Maker | Atmel (Microchip) | - | - | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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