ADN2890ACPZ-RL datasheet, PDF - EEWORLD Datasheet

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ADN2890ACPZ-RL: DescriptionSPECIALTY TELECOM CIRCUIT, QCC16, 3 X 3 MM, MO-220-VEED-2, LFCSP-16; CategoryWireless rf/communication Telecom circuit; File Size914KB，13 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/; Environmental Compliance

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ADN2890ACPZ-RL Overview

SPECIALTY TELECOM CIRCUIT, QCC16, 3 X 3 MM, MO-220-VEED-2, LFCSP-16

ADN2890ACPZ-RL Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	16
Reach Compliance Code	unknow
JESD-30 code	S-XQCC-N16
JESD-609 code	e3
length	3 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Certification status	COMMERCIAL
Maximum seat height	1 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	3 mm
Base Number Matches	1

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ADN2890ACPZ-RL Related Products

	ADN2890ACPZ-RL	ADN2890ACPZ-RL7	ADN2890ACP-RL7
Description	SPECIALTY TELECOM CIRCUIT, QCC16, 3 X 3 MM, MO-220-VEED-2, LFCSP-16	SPECIALTY TELECOM CIRCUIT, QCC16, 3 X 3 MM, MO-220-VEED-2, LFCSP-16	SPECIALTY TELECOM CIRCUIT, QCC16, 3 X 3 MM, MO-220-VEED-2, LFCSP-16
Is it lead-free?	Lead free	Lead free	Contains lead
Is it Rohs certified?	conform to	conform to	incompatible
Parts packaging code	QFN	QFN	QFN
package instruction	HVQCCN,	HVQCCN,	HVQCCN,
Contacts	16	16	16
Reach Compliance Code	unknow	unknow	unknow
JESD-30 code	S-XQCC-N16	S-XQCC-N16	S-XQCC-N16
JESD-609 code	e3	e3	e0
length	3 mm	3 mm	3 mm
Humidity sensitivity level	3	3	3
Number of functions	1	1	1
Number of terminals	16	16	16
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	HVQCCN	HVQCCN	HVQCCN
Package shape	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	240
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	1 mm	1 mm	1 mm
Nominal supply voltage	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	MATTE TIN	TIN LEAD
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	40	40	30
width	3 mm	3 mm	3 mm
Base Number Matches	1	1	1

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