Intel
®
Pentium
®
D Processor
900
Δ
Sequence and Intel
®
Pentium
®
Processor Extreme
Edition 955
Δ
, 965
Δ
Datasheet
– On 65 nm Process in the 775-land LGA Package supporting
Intel
®
64 Architecture and supporting Intel
®
Virtualization
Technology
±
January 2007
Document Number: 310306-007
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING
TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT
INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
Pentium D processor 900 sequence and Intel
®
Pentium processor Extreme Edition 955, 965 may contain design defects or errors known as
errata which may cause the product to deviate from published specifications.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Δ
Intel
processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different
processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in
clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular
feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/
processor_number for details.
Hyper-Threading Technology requires a computer system with an Intel
®
Pentium
®
processor Extreme Edition supporting Hyper-Threading Technology
and an HT Technology enabled chipset, BIOS, and an operating system. Performance will vary depending on the specific hardware and software you use.
See <http://www.intel.com/products/ht/hyperthreading_more.htm> for information including details on which processors support HT Technology.
Φ
Intel
®
†
64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64.
Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and
software configurations. See http://www.intel.com/technology/intel64/index.htm for more information including details on which processors support
Intel 64, or consult with your system vendor for more information.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check
with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
±
Intel
®
Virtualization Technology requires a computer system with an enabled Intel
®
processor, BIOS, virtual machine monitor (VMM) and, for some
uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations
and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.
Not all specified units of this processor support Enhanced HALT State and Enhanced Intel SpeedStep
®
Technology. See the Processor Spec Finder at
http://processorfinder.intel.com or contact your Intel representative for more information.
Intel, Pentium, Intel NetBurst, Intel SpeedStep, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005–2007 Intel Corporation.
2
Datasheet
ContentsContents
1
Introduction
............................................................................................................ 11
1.1
Terminology ..................................................................................................... 12
1.1.1 Processor Packaging Terminology ............................................................. 12
1.2
References ....................................................................................................... 13
Electrical Specifications
........................................................................................... 15
2.1
Power and Ground Lands.................................................................................... 15
2.2
Decoupling Guidelines ........................................................................................ 15
2.2.1 V
CC
Decoupling ...................................................................................... 15
2.2.2 V
TT
Decoupling ...................................................................................... 15
2.2.3 FSB Decoupling...................................................................................... 16
2.3
Voltage Identification ......................................................................................... 16
2.4
Reserved, Unused, and TESTHI Signals ................................................................ 18
2.5
Voltage and Current Specification ........................................................................ 19
2.5.1 Absolute Maximum and Minimum Ratings .................................................. 19
2.5.2 DC Voltage and Current Specification ........................................................ 20
2.5.3 VCC Overshoot ...................................................................................... 24
2.5.4 Die Voltage Validation ............................................................................. 25
2.6
Signaling Specifications...................................................................................... 25
2.6.1 FSB Signal Groups.................................................................................. 26
2.6.2 GTL+ Asynchronous Signals..................................................................... 28
2.6.3 Processor DC Specifications ..................................................................... 28
2.6.3.1 GTL+ Front Side Bus Specifications ............................................. 31
2.7
Clock Specifications ........................................................................................... 32
2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 32
2.7.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 32
2.7.3 Phase Lock Loop (PLL) and Filter .............................................................. 33
2.7.4 BCLK[1:0] Specifications ......................................................................... 35
Package Mechanical Specifications
.......................................................................... 37
3.1
Package Mechanical Drawing............................................................................... 37
3.2
Processor Component Keep-Out Zones ................................................................. 41
3.3
Package Loading Specifications ........................................................................... 41
3.4
Package Handling Guidelines............................................................................... 41
3.5
Package Insertion Specifications.......................................................................... 41
3.6
Processor Mass Specification ............................................................................... 42
3.7
Processor Materials............................................................................................ 42
3.8
Processor Markings............................................................................................ 42
3.9
Processor Land Coordinates ................................................................................ 43
Land Listing and Signal Descriptions
....................................................................... 45
4.1
Processor Land Assignments ............................................................................... 45
4.2
Alphabetical Signals Reference ............................................................................ 70
Thermal Specifications and Design Considerations
.................................................. 81
5.1
Processor Thermal Specifications ......................................................................... 81
5.1.1 Thermal Specifications ............................................................................ 81
5.1.2 Thermal Metrology ................................................................................. 85
5.2
Processor Thermal Features ................................................................................ 85
5.2.1 Thermal Monitor..................................................................................... 85
5.2.2 On-Demand Mode .................................................................................. 86
5.2.3 PROCHOT# Signal .................................................................................. 86
5.2.4 FORCEPR# Signal................................................................................... 87
2
3
4
5
Datasheet
3
5.2.5
5.2.6
5.2.7
6
THERMTRIP# Signal ................................................................................88
T
CONTROL
and Fan Speed Reduction ...........................................................88
Thermal Diode........................................................................................88
Features
..................................................................................................................91
6.1
Power-On Configuration Options ..........................................................................91
6.2
Clock Control and Low Power States .....................................................................91
6.2.1 Normal State .........................................................................................92
6.2.2 HALT and Enhanced HALT Powerdown States..............................................92
6.2.2.1 HALT Powerdown State ..............................................................92
6.2.2.2 Enhanced HALT Powerdown State................................................93
6.2.3 Stop Grant State ....................................................................................93
6.2.4 Enhanced HALT Snoop or HALT Snoop State,
Stop Grant Snoop State...........................................................................94
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................94
6.2.4.2 Enhanced HALT Snoop State .......................................................94
6.2.5 Enhanced Intel
®
SpeedStep
®
Technology ..................................................94
Boxed Processor Specifications................................................................................95
7.1
Mechanical Specifications ....................................................................................95
7.1.1 Boxed Processor Cooling Solution Dimensions.............................................95
7.1.2 Boxed Processor Fan Heatsink Weight .......................................................97
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly...............................................................................97
7.2
Electrical Requirements ......................................................................................97
7.2.1 Fan Heatsink Power Supply ......................................................................97
7.3
Thermal Specifications........................................................................................99
7.3.1 Boxed Processor Cooling Requirements......................................................99
Balanced Technology Extended (BTX) Boxed Processor Specifications
................... 101
8.1
Mechanical Specifications .................................................................................. 102
8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor
Cooling Solution Dimensions .................................................................. 102
8.1.2 Boxed Processor Thermal Module Assembly Weight ................................... 104
8.1.3 Boxed Processor Support and Retention Module (SRM) .............................. 104
8.2
Electrical Requirements .................................................................................... 105
8.2.1 Thermal Module Assembly Power Supply .................................................. 105
8.3
Thermal Specifications...................................................................................... 107
8.3.1 Boxed Processor Cooling Requirements.................................................... 107
8.3.2 Variable Speed Fan ............................................................................... 108
Debug Tools Specifications
.................................................................................... 111
9.1
Logic Analyzer Interface (LAI) ........................................................................... 111
9.1.1 Mechanical Considerations ..................................................................... 111
9.1.2 Electrical Considerations ........................................................................ 111
7
8
9
4
Datasheet
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
V
CC
Static and Transient Tolerance for 775_VR_CONFIG_05A (Mainstream) and
775_VR_CONFIG_05B (Performance) Processors .......................................................... 24
V
CC
Overshoot Example Waveform ............................................................................. 25
Phase Lock Loop (PLL) Filter Requirements .................................................................. 34
Processor Package Assembly Sketch ........................................................................... 37
Processor Package Drawing Sheet 1 of 3 ..................................................................... 38
Processor Package Drawing Sheet 2 of 3 ..................................................................... 39
Processor Package Drawing Sheet 3 of 3 ..................................................................... 40
Processor Top-Side Markings Example (Intel
®
Pentium
®
D Processor 900 Sequence) ........ 42
Processor Top-Side Markings Example (Intel
®
Pentium
®
Processor Extreme Edition 955,
965)....................................................................................................................... 43
Processor Land Coordinates and Quadrants (Top View) ................................................. 44
land-out Diagram (Top View – Left Side) ..................................................................... 46
land-out Diagram (Top View – Right Side) ................................................................... 47
Thermal Profile for 775_VR_CONFIG_05B Processors (Performance) ............................... 83
Thermal Profile for 775_VR_CONFIG_05A Processors (Mainstream)................................. 84
Case Temperature (TC) Measurement Location ............................................................ 85
Processor Low Power State Machine ........................................................................... 92
Mechanical Representation of the Boxed Processor ....................................................... 95
Space Requirements for the Boxed Processor (Side View: applies to all four side views) .... 96
Space Requirements for the Boxed Processor (Top View)............................................... 96
Space Requirements for the Boxed Processor (Overall View) .......................................... 97
Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 98
Baseboard Power Header Placement Relative to Processor Socket ................................... 99
Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 1 View) ........................................................................................................ 100
Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 2 View) ........................................................................................................ 100
Mechanical Representation of the Boxed Processor with a Type I TMA ........................... 101
Mechanical Representation of the Boxed Processor with a Type II TMA .......................... 102
Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes ..... 103
Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume ..... 104
Assembly Stack Including the Support and Retention Module ....................................... 105
Boxed Processor TMA Power Cable Connector Description ............................................ 106
Balanced Technology Extended (BTX) Mainboard Power Header Placement
(Hatched Area) ...................................................................................................... 107
Boxed Processor TMA Set Points............................................................................... 108
Datasheet
5
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