Lead Temperature (soldering, 10 seconds max ........... .+300°C *
* NOTE: Refer to Reflow Profile for SMD Models.
Ordering Information
HPR
1XX V/W
/H
Device Family
HPR Indicates DC/DC Converter
Model Number
Selected from Table of Electrical Characteristics
Package Option
There is "no" package designator for the SIP package
V = DIP Package
W = SMD Package
Screening Option
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responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent
rights or licenses to any of the circuits described herein are implied or granted to any third party. C&D TECHNOLOGIES does not authorize or warrant any C&D TECHNOLOGIES product
for use in life support devices/systems or in aircraft control applications.
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Embedded System
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