R65C10C4E datasheet, PDF - EEWORLD Datasheet

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R65C10C4E: DescriptionRISC Microprocessor, 8-Bit, 4MHz, CMOS, CDIP40,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，23 Pages; ManufacturerCONEXANT; Websitehttp://www.conexant.com/

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R65C10C4E Overview

RISC Microprocessor, 8-Bit, 4MHz, CMOS, CDIP40,

R65C10C4E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	CONEXANT
Reach Compliance Code	compliant
bit size	8
JESD-30 code	R-XDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
speed	4 MHz
Maximum slew rate	10 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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R65C10C4E Related Products

	R65C10C4E	R65C10C3E	R65C10J3E	R65C10J4E	R65C10P3E	R65C10P4E
Description	RISC Microprocessor, 8-Bit, 4MHz, CMOS, CDIP40,	RISC Microprocessor, 8-Bit, 3MHz, CMOS, CDIP40,	RISC Microprocessor, 8-Bit, 3MHz, CMOS, PQCC44,	RISC Microprocessor, 8-Bit, 4MHz, CMOS, PQCC44,	RISC Microprocessor, 8-Bit, 3MHz, CMOS, PDIP40,	RISC Microprocessor, 8-Bit, 4MHz, CMOS, PDIP40,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	CONEXANT	CONEXANT	CONEXANT	CONEXANT	CONEXANT	CONEXANT
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
bit size	8	8	8	8	8	8
JESD-30 code	R-XDIP-T40	R-XDIP-T40	S-PQCC-J44	S-PQCC-J44	R-PDIP-T40	R-PDIP-T40
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	40	40	44	44	40	40
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	QCCJ	QCCJ	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	4 MHz	3 MHz	3 MHz	4 MHz	3 MHz	4 MHz
Maximum slew rate	10 mA	7.5 mA	7.5 mA	10 mA	7.5 mA	10 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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