Cache SRAM, 16KX15, 13ns, CMOS, PQCC52, PLASTIC, LCC-52
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Pyramid Semiconductor Corporation |
| Parts packaging code | LCC |
| package instruction | QCCJ, LDCC52,.8SQ |
| Contacts | 52 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 13 ns |
| Other features | ADDRESS LATCH; DUAL 8K X 15 |
| I/O type | COMMON |
| JESD-30 code | S-PQCC-J52 |
| JESD-609 code | e0 |
| length | 19.1262 mm |
| memory density | 245760 bit |
| Memory IC Type | CACHE SRAM |
| memory width | 15 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 52 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 16KX15 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC52,.8SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum standby current | 0.36 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.36 mA |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 19.1262 mm |
| P4C215-13PP52C | P4C216-13PP52C | P4C215-23SR52B | P4C215-23PP52C | P4C215-17SR52B | P4C216-17PP52C | P4C215-17PP52C | P4C216-23PP52C | P4C216-23SR52B | P4C216-17SR52B | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Cache SRAM, 16KX15, 13ns, CMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 16KX16, 13ns, CMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 16KX15, 23ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52 | Cache SRAM, 16KX15, 23ns, CMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 16KX15, 17ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52 | Cache SRAM, 16KX16, 17ns, CMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 16KX15, 17ns, CMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 16KX16, 23ns, CMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 16KX16, 23ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52 | Cache SRAM, 16KX16, 17ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | LCC | LCC | LCC | LCC | LCC | LCC | LCC | LCC | LCC | LCC |
| package instruction | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ |
| Contacts | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 13 ns | 13 ns | 23 ns | 23 ns | 17 ns | 17 ns | 17 ns | 23 ns | 23 ns | 17 ns |
| Other features | ADDRESS LATCH; DUAL 8K X 15 | ADDRESS LATCH; DUAL 8K X 16 | ADDRESS LATCH; DUAL 8K X 15 | ADDRESS LATCH; DUAL 8K X 15 | ADDRESS LATCH; DUAL 8K X 15 | ADDRESS LATCH; DUAL 8K X 16 | ADDRESS LATCH; DUAL 8K X 15 | ADDRESS LATCH; DUAL 8K X 16 | ADDRESS LATCH; DUAL 8K X 16 | ADDRESS LATCH; DUAL 8K X 16 |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | S-PQCC-J52 | S-PQCC-J52 | S-CQCC-J52 | S-PQCC-J52 | S-CQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-CQCC-J52 | S-CQCC-J52 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 19.1262 mm | 19.1262 mm | 19.05 mm | 19.1262 mm | 19.05 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.05 mm | 19.05 mm |
| memory density | 245760 bit | 262144 bit | 245760 bit | 245760 bit | 245760 bit | 262144 bit | 245760 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| memory width | 15 | 16 | 15 | 15 | 15 | 16 | 15 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 |
| word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| character code | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| organize | 16KX15 | 16KX16 | 16KX15 | 16KX15 | 16KX15 | 16KX16 | 16KX15 | 16KX16 | 16KX16 | 16KX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 4.57 mm | 3.175 mm | 4.57 mm | 3.175 mm | 4.57 mm | 4.57 mm | 4.57 mm | 3.175 mm | 3.175 mm |
| Maximum standby current | 0.36 A | 0.36 A | 0.36 A | 0.36 A | 0.36 A | 0.36 A | 0.36 A | 0.36 A | 0.36 A | 0.36 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.36 mA | 0.36 mA | 0.36 mA | 0.36 mA | 0.36 mA | 0.36 mA | 0.36 mA | 0.36 mA | 0.36 mA | 0.36 mA |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| width | 19.1262 mm | 19.1262 mm | 19.05 mm | 19.1262 mm | 19.05 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.05 mm | 19.05 mm |
| Maker | Pyramid Semiconductor Corporation | - | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation |