P4C216-17SR52B datasheet, PDF - EEWORLD Datasheet

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P4C216-17SR52B: DescriptionCache SRAM, 16KX16, 17ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52; Categorystorage storage; File Size247KB，8 Pages; ManufacturerPyramid Semiconductor Corporation; Websitehttp://www.pyramidsemiconductor.com/

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P4C216-17SR52B Overview

Cache SRAM, 16KX16, 17ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52

P4C216-17SR52B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Pyramid Semiconductor Corporation
Parts packaging code	LCC
package instruction	QCCJ, LDCC52,.8SQ
Contacts	52
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	17 ns
Other features	ADDRESS LATCH; DUAL 8K X 16
I/O type	COMMON
JESD-30 code	S-CQCC-J52
JESD-609 code	e0
length	19.05 mm
memory density	262144 bit
Memory IC Type	CACHE SRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	52
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX16
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	3.175 mm
Maximum standby current	0.36 A
Minimum standby current	4.5 V
Maximum slew rate	0.36 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	19.05 mm

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Description	Cache SRAM, 16KX16, 17ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52	Cache SRAM, 16KX16, 13ns, CMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 16KX15, 23ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52	Cache SRAM, 16KX15, 23ns, CMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 16KX15, 17ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52	Cache SRAM, 16KX15, 13ns, CMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 16KX16, 17ns, CMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 16KX15, 17ns, CMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 16KX16, 23ns, CMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 16KX16, 23ns, CMOS, CQCC52, HERMETIC SEALED, CERAMIC, LCC-52
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	LCC	LCC	LCC	LCC	LCC	LCC	LCC	LCC	LCC	LCC
package instruction	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ
Contacts	52	52	52	52	52	52	52	52	52	52
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	EAR99	3A001.A.2.C	EAR99	3A001.A.2.C	EAR99	EAR99	EAR99	EAR99	3A001.A.2.C
Maximum access time	17 ns	13 ns	23 ns	23 ns	17 ns	13 ns	17 ns	17 ns	23 ns	23 ns
Other features	ADDRESS LATCH; DUAL 8K X 16	ADDRESS LATCH; DUAL 8K X 16	ADDRESS LATCH; DUAL 8K X 15	ADDRESS LATCH; DUAL 8K X 15	ADDRESS LATCH; DUAL 8K X 15	ADDRESS LATCH; DUAL 8K X 15	ADDRESS LATCH; DUAL 8K X 16	ADDRESS LATCH; DUAL 8K X 15	ADDRESS LATCH; DUAL 8K X 16	ADDRESS LATCH; DUAL 8K X 16
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-CQCC-J52	S-PQCC-J52	S-CQCC-J52	S-PQCC-J52	S-CQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-CQCC-J52
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	19.05 mm	19.1262 mm	19.05 mm	19.1262 mm	19.05 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.05 mm
memory density	262144 bit	262144 bit	245760 bit	245760 bit	245760 bit	245760 bit	262144 bit	245760 bit	262144 bit	262144 bit
Memory IC Type	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
memory width	16	16	15	15	15	15	16	15	16	16
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1	1
Number of terminals	52	52	52	52	52	52	52	52	52	52
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	125 °C	70 °C	125 °C	70 °C	70 °C	70 °C	70 °C	125 °C
organize	16KX16	16KX16	16KX15	16KX15	16KX15	16KX15	16KX16	16KX15	16KX16	16KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.175 mm	4.57 mm	3.175 mm	4.57 mm	3.175 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	3.175 mm
Maximum standby current	0.36 A	0.36 A	0.36 A	0.36 A	0.36 A	0.36 A	0.36 A	0.36 A	0.36 A	0.36 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.36 mA	0.36 mA	0.36 mA	0.36 mA	0.36 mA	0.36 mA	0.36 mA	0.36 mA	0.36 mA	0.36 mA
Maximum supply voltage (Vsup)	5.5 V	5.25 V	5.5 V	5.25 V	5.5 V	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.75 V	4.5 V	4.75 V	4.5 V	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	19.05 mm	19.1262 mm	19.05 mm	19.1262 mm	19.05 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.05 mm
Maker	Pyramid Semiconductor Corporation	-	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation

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