Application Report
SZZA047 - July 2004
Semiconductor Packing Material
Electrostatic Discharge (ESD) Protection
Albert Escusa and Lance Wright
ABSTRACT
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI)
standard packing methodology were subjected to electrical discharges between 0.5 and 20
kV, as generated by an IEC ESD simulator to determine the level of ESD protection provided
by the packing materials. The testing included trays, tape and reel, and magazines.
Additional units were subjected to the same discharge, without the protection of the packing
material. Test results showed that the packing materials used by TI provide protection up to
20 kV, and that a level of ESD protection is required. The die in the components had a Charge
Device Model (CDM) rating of 0.5 kV, and all units experiencing a discharge greater than 500
V sustained sufficient electrical overstress to fail electrical testing when outside of the packing
materials.
Standard Linear and Logic
Contents
1
2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Packing Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Tube Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Tray Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Tape-and-Reel Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
4
3
Test Equipment and Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.1 3M SED Procedure for Trays/Tape and Reel/Tubes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.2 IEC ESD Simulator Procedure for Trays/Tape and Reel/Tubes . . . . . . . . . . . . . . . . . . . . . . . . . 6
Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1 Tray-Stack Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1.1 Event-Detector Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1.2 Tray Packing Results on Live TSSOP Devices Using IED Gun . . . . . . . . . . . . . . . . . . 8
5.2 Tape-and-Reel Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2.1 Event-Detector Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2.2 Tape-and-Reel Packing Results on Live TSSOP Devices Using IEC Gun . . . . . . . . 10
5.3 Tube Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3.1 Tube Event-Detector Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3.2 Tube Packing Results on Live TSSOP Devices Using IEC Gun . . . . . . . . . . . . . . . . 12
5.4 Results of Unpackaged Live TSSOP Devices Using IEC Gun . . . . . . . . . . . . . . . . . . . . . . . . 14
4
5
Trademarks are the property of their respective owners.
1
SZZA047
6
7
Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
List of Figures
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
Event-Detector Locations in Tray Stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Tray Stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Tray Stack in Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Event-Detector Locations in Reel (Used 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Carrier-Tape Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Tape-and-Reel Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Event-Detector Locations in Magazine Bundle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Bundle of Tubes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Tube Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Carbon-Lined Bag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Test Socket for Live Die Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
List of Tables
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
Test Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Event-Detector Feedback for Black PPE-Tray Packing Configurations . . . . . . . . . . . . . . . . . . . . . . 7
Event-Detector Feedback for Blue Dipped-Tray Packing Configurations . . . . . . . . . . . . . . . . . . . . . 7
ESD Testing on Live TSSOP Devices for Black PPE-Tray Packing Configurations . . . . . . . . . . . . 8
ESD Testing on Live TSSOP Devices for Blue Dipped-Tray Packing Configurations . . . . . . . . . . 8
Event-Detector Feedback for Black Static-Dissipative-Reel Packing Configurations . . . . . . . . . . . 9
Event-Detector Feedback for Blue Dipped-Reel Packing Configurations . . . . . . . . . . . . . . . . . . . . 10
ESD Testing on Live TSSOP Devices for Black Reel Packing Configurations . . . . . . . . . . . . . . . 10
ESD Testing on Live TSSOP Devices for Blue Dipped-Reel Packing Configurations . . . . . . . . . 10
Event-Detector Feedback for Clear Antistatic Tube Packing Configurations . . . . . . . . . . . . . . . . . 11
Event-Detector Feedback for Black Tube Packing Configurations . . . . . . . . . . . . . . . . . . . . . . . . . 12
ESD Testing on Live TSSOP Devices for Clear Antistatic Tube Packing Configurations . . . . . . 12
ESD Testing on Live TSSOP Devices for Black Tube Packing Configurations . . . . . . . . . . . . . . . 12
ESD Ground-Pin Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2
Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
SZZA047
1
Introduction
Texas Instruments (TI) ships over 5-billion semiconductor devices on an annual basis. To ensure
that these devices reach the customer in good condition, they must be packaged appropriately
to withstand the potential damage of shipping. Semiconductor packing materials must protect
the units from physical damage, vibration shock, and electrostatic discharge (ESD).
Static electricity is a natural phenomenon. Delicate electronic components are easily damaged
by ESD, and subsequent faults in assembled finished products can be costly. Packing media is
used to protect against ESD, as ICs are delivered to the customer and include items such as
trays, tape and reel, tubes or magazines, boxes, and bags. These items must have a surface
resistance in the static dissipate range of greater than 1x10
4
Ω/sq,
but less than 1x10
11
Ω/sq
per
ANSI/EOS/ESD S11.11-2001, in order to control a discharge. If the surface resistance is too
small, a charge can dissipate too quickly and electrically overstress the ICs within the packing
medium.
The purpose of this application report is to demonstrate that TI packing methods provide
sufficient ESD protection when used in accordance with EIA-541 and EIA-625 material-handling
guidelines. Packing methods in use today by TI are tape and reel, tray, and tubes. A typical logic
device has minimum ESD criteria, unless approved by a waiver from the Quality department:
[Human-Body Model (HBM), 2000 V] [Charge-Device Model (CDM), 500 V]. The testing
performed in this study was done using a die meeting these minimum requirements, and the
testing performed simulated the CDM. For more information on HBM and CDM, please see the
TI application report,
Electrostatic Discharge (ESD),
literature number SSYA010, located at
www.ti.com.
2
2.1
Packing Methods
Tube Packing Method
When a customer receives devices packed in tubes, they receive a carbon-lined cardboard box
for surface-mount components. The surface-mount technology (SMT) components are wrapped
in bubble wrap that has an antistatic coating if the moisture sensitivity rating is level 1 (MSL 1). If
not, the tubes are put in a moisture-barrier bag (MBB) and placed in a cardboard box. For
through-hole components, the tubes are shipped inside a carbon-lined bag. Through-hole
components are not moisture sensitive and do not require drypack in an MBB.
2.2
Tray Packing Method
Trays are sent to the customer in a stacked arrangement. There is 4+1, 5+1, or 10+1 tray
stacking, which means that 4, 5, or 10 trays have units with a top tray that is empty. The top tray
acts as a cover. A single carbon-lined cardboard sheet is put on the top and bottom of the tray
stack and bound together with a conductive plastic strap. If the devices are moisture sensitive,
the bundle is drypacked in an MBB and placed in a box with a carbon-lined insert/sleeve. The
top and bottom cardboard sheets and insert provide the Faraday cage (ESD shielding). If the
units are not moisture sensitive, the bundle is wrapped in antistatic bubble wrap and placed in a
non-carbon-lined box.
Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
3
SZZA047
2.3
Tape-and-Reel Packing Method
Devices in static-dissipative carrier tape are wound onto an intrinsically static-dissipative reel.
This reel, if moisture sensitive, is placed in an MBB and placed in a non-carbon-lined cardboard
box. If the devices are not moisture sensitive, the reel is placed in the non-carbon-lined box,
without bubble wrap or MBB. The reel has an extra layer of winding at the inner and outer hub to
provide the Faraday cage. The customer receives one reel per box.
3
Text Equipment and Materials
The instruments and materials listed in section 3.2 were used to conduct the ESD tests. The
packing materials listed were qualified in accordance with TI internal qualification procedures.
3.1
Instruments
1. NoiseKen, ESS-2000 IEC ESD Simulator. This instrument, shown in the background of
Figure 2, is used to generate ESD on the packing materials.
2. 3M Event Detector, 37 V. The device is one cubic inch and has a window that turns red
when exposed to 37 V, or higher. The window remains black when exposed to <37 V.
3.2
Materials
All the packing materials listed in Table 1 are TI production materials that are qualified in
accordance with Quality Standard 007-001.
Table 1. Test Materials
TI PART NUMBER
4200101-0001
RH Murphy
4204205-0003
4200038-0003
4041338-0001
-034 (Burr Brown)
4200734-0004
4200734-0003
4200734-0001
4045704-0025
4045704-0026
1041370-0104
1041370-0112
1041285-0031
1041286-0146
1041286-0117
4078201-0001
RATED SURFACE RESISTIVITY
1x10e7
Ω/sq
1x10e5
Ω/sq
1x10e9
Ω/sq
1x10e10
Ω/sq
1x10e9
Ω
1x10e3
Ω
1x10e8
Ω/sq
1x10e10
Ω/sq
1x10e10
Ω/sq
Interior/exterior: 1x10e10
Ω/sq,
Metal: 100
Ω
Interior/exterior: 1x10e10
Ω/sq,
Metal: 100
Ω/sq
1x10e4
Ω/sq
1x10e4
Ω/sq
NA
NA
1x10e4
Ω/sq
1x10e4
Ω/sq
MATERIAL DESCRIPTION
Tray, black, PPE
Tray, blue, antistatic, dipped, ABS
13-in black intrinsically static dissipative reel
13-in blue antistatic dipped reel
Tube, clear antistatic, PVC
Tube, black, conductive
MBB for tube
MBB for tray, aluminum
MBB for tape and reel, aluminum
ESD shielding bag for tape and reel
ESD shielding bag for tray
Conductive insert/sleeve, carbon lined
Corrugated conductive pad, carbon lined
Pizza box, intermediate container for 13-in reel
Intermediate single JEDEC box for tray
Carbon-lined intermediate box for tube
Carbon-lined conductive paper bag
4
Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
SZZA047
4
Test Procedure
ESD testing consists of two tests. The first test uses a 37-V Static Event Detector (SED),
manufactured by 3M. The detector is placed within the packing materials (see Figures 1, 4,
and 7) to simulate a “packaged” device. The IEC ESD simulator then is used to discharge 0.5 kV
to 20 kV on the packing configuration. The detector window turns red if it has been exposed to
>37 V. SEDs that experience 37 V indicate that more testing is needed, as the device may be
susceptible to damage due to ESD by exposure to voltages greater than 500 V. The minimum
voltage chosen was 0.5 kV, as this is the CDM ESD rating standard TI die. The maximum
voltage chosen was 20 kV, since it is the maximum value that can be discharged in an
exceptionally low-humidity environment when all handling is in accordance with EIA 541/625.
The second test is a repeat of the first test, with known good devices being packed instead of
SEDs. Additionally, this device is placed in a test socket (see Figure 11) and the discharge is
made directly to the ground pins. For this test, a 48-pin TSSOP package was chosen with a
SSTV16857 Rev C die. This die was chosen because it has the minimum allowable values for
HBM and CDM, which are 2000 and 500 V, respectively. These two tests relate to ESD
sensitivity and are described in detail in TI application report,
Electrostatic Discharge (ESD),
literature number SSYA010. Devices with lower values must have a waiver from QA prior to
production shipping. The premise for this test is that no failures prove that TI packing
methodology is sufficient in accordance with the EIA 541/625 ESD packing material and
handling guidelines that TI follows.
The ESD simulator chosen in this study complies with the industry specification IEC 61000-4-2
for system-level ESD evaluation. It generates a more severe stress compared to those specified
in the JEDEC standards of JESD22-A104 for component-level HBM and JESD22-C101 for
component-level CDM. The stress generated by the ESD simulator includes both
component-level HBM and CDM stresses. In addition, at a same-stress voltage level, the
ESD simulator produces an ESD pulse of a greater magnitude than those of the
component-level HBM and CDM stresses. The component-level HBM and CDM tests are
specified in the JEDEC standards and are included in the TI internal specifications for device
qualification. The minimum requirements are 2000 V for HBM and 500 V for CDM. A device with
marginal ESD performance, in accordance with the TI ESD specification, was chosen in this
study.
4.1
3M SED Procedure for Trays/Tape and Reel/Tubes
1. Reset all 37-V SEDs by swiping next to a magnet.
2. Distribute the detectors evenly in the packing material as shown in Figures 1, 4, and 7.
3. Shoot the ESD generator at six different spots around the packing material and record the
result.
4. Perform the same test on the other packing configurations, as shown in the test matrix.
Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
5
Embedded System
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