HY62UF16406D-SM55I datasheet, PDF

EEWORLDEEWORLD

Datasheet

Datasheet> All Categories > storage> storage> HY62UF16406D-SM55I

Preview

HY62UF16406D-SM55I: DescriptionStandard SRAM, 256KX16, 55ns, CMOS, PBGA48, FINE PITCH, BGA-48; Categorystorage storage; File Size271KB，10 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

Download Datasheet Parametric Compare View All

HY62UF16406D-SM55I Overview

Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, FINE PITCH, BGA-48

HY62UF16406D-SM55I Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	BGA
package instruction	TFBGA, BGA48,6X8,30
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B48
JESD-609 code	e0
length	8 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3 V
Certification status	Not Qualified
Maximum seat height	1.1 mm
Maximum standby current	0.000006 A
Minimum standby current	1.5 V
Maximum slew rate	0.04 mA
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6.1 mm

Preview

Download Datasheet

View All

HY62UF16406D-SM55I Related Products

	HY62UF16406D-SM55I	HY62UF16406D-DM55I	HY62UF16406D-DM70I	HY62UF16406D-SM70I
Description	Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, FINE PITCH, BGA-48	Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, FINE PITCH, BGA-48	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, FINE PITCH, BGA-48	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, FINE PITCH, BGA-48
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30
Contacts	48	48	48	48
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	55 ns	55 ns	70 ns	70 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
JESD-609 code	e0	e0	e0	e0
length	8 mm	8 mm	8 mm	8 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16
Number of functions	1	1	1	1
Number of terminals	48	48	48	48
word count	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	256KX16	256KX16	256KX16	256KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.1 mm	1.1 mm	1.1 mm	1.1 mm
Maximum standby current	0.000006 A	0.000012 A	0.000012 A	0.000006 A
Minimum standby current	1.5 V	1.5 V	1.5 V	1.5 V
Maximum slew rate	0.04 mA	0.04 mA	0.04 mA	0.04 mA
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	6.1 mm	6.1 mm	6.1 mm	6.1 mm

Recommended Resources

Stabilized power supply overcurrent protection circuit 3a

Temperature regulator drying room temperature control circuit three

Using power transformer step-down circuit

555 multivibrator circuit that can output symmetrical waves

Remote control fan circuit

845E computer motherboard circuit diagram_67

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components