datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > storage> storage> HY62UF16406D-SM70I
PDF
Preview

HY62UF16406D-SM70I

Description
Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, FINE PITCH, BGA-48
Categorystorage    storage   
File Size271KB，10 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

HY62UF16406D-SM70I Overview

Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, FINE PITCH, BGA-48

HY62UF16406D-SM70I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeBGA
package instructionTFBGA, BGA48,6X8,30
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length8 mm
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,30
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum standby current0.000006 A
Minimum standby current1.5 V
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)3.3 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width6.1 mm

Preview

Download Datasheet

HY62UF16406D-SM70I Related Products

HY62UF16406D-SM70I HY62UF16406D-DM55I HY62UF16406D-DM70I HY62UF16406D-SM55I
Description Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, FINE PITCH, BGA-48 Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, FINE PITCH, BGA-48 Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, FINE PITCH, BGA-48 Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, FINE PITCH, BGA-48
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker SK Hynix SK Hynix SK Hynix SK Hynix
Parts packaging code BGA BGA BGA BGA
package instruction TFBGA, BGA48,6X8,30 TFBGA, BGA48,6X8,30 TFBGA, BGA48,6X8,30 TFBGA, BGA48,6X8,30
Contacts 48 48 48 48
Reach Compliance Code unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 70 ns 55 ns 70 ns 55 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B48 R-PBGA-B48 R-PBGA-B48 R-PBGA-B48
JESD-609 code e0 e0 e0 e0
length 8 mm 8 mm 8 mm 8 mm
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16
Number of functions 1 1 1 1
Number of terminals 48 48 48 48
word count 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 256KX16 256KX16 256KX16 256KX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TFBGA TFBGA
Encapsulate equivalent code BGA48,6X8,30 BGA48,6X8,30 BGA48,6X8,30 BGA48,6X8,30
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3 V 3 V 3 V 3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm 1.1 mm 1.1 mm 1.1 mm
Maximum standby current 0.000006 A 0.000012 A 0.000012 A 0.000006 A
Minimum standby current 1.5 V 1.5 V 1.5 V 1.5 V
Maximum slew rate 0.04 mA 0.04 mA 0.04 mA 0.04 mA
Maximum supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL
Terminal pitch 0.75 mm 0.75 mm 0.75 mm 0.75 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 6.1 mm 6.1 mm 6.1 mm 6.1 mm

Recommended Resources

Full-wave capacitor step-down rectifier circuit a

High dynamic, low distortion all-crystal triode three-stage differential power amplifier

Intelligent carbon monoxide alarm circuit

split phase amplifier circuit

Computer motherboard circuit diagram 815 5_16

555 electric blanket thermostat circuit

CLK0~3 pins issue in LPC43xx
Recently, I used lpc4357 to drive a 7-inch screen with external SDRAM, using MT48LC4M32B2P. During the initialization process, because only EMC_CLK0 was used, only the CLK0 pin was configured LPC_SCU-...
jplzl10000 NXP MCU
[====================]wince 5.0 C# numericUpDown control cannot display decimals
Clicking up and down doesn't work??? Why is this? Who has used this unfortunate control in wince? [img]http://benyouhuifile.it168.com/attachments/day_091014/20091014_5d5b6cfbbe15f2a8ab65ICGMg1CmE6l2.j...
gaas Embedded System
A novice is looking for a solution to the external crystal oscillator problem???
//************************************************ **************************** // MSP430G2xx3 Demo - WDT, Toggle P1.0, Interval Overflow ISR, 32kHz ACLK // // Description: Toggle P1.0 using software ...
p471289908 Microcontroller MCU
What are the main controllers in industry and what are the remote communication methods?
[i=s]This post was last edited by Mr. Lan on 2020-3-9 09:49[/i]The main controls are: 1.PLC, advantages: relatively mature technology, stable performance, low cost, simple programming 2. Single chip m...
蓝先生 Industrial Control Electronics
【Video Sharing】MSP430 Medical Product Application
Introduction: MSP430 is an ultra-low power microcontroller that is very suitable for portable products and portable medical products. Designing portable medical products usually requires low system co...
德州仪器_视频 Microcontroller MCU
C6678: How does the malloc function do byte alignment
The size of the matrix is a function parameter. We want to apply for dynamic cache as a dynamic array, but many subsequent vector operations must be byte-aligned to be calculated, such as DSPF_sp_vecr...
alan000345 Microcontroller MCU
Shortcut:   E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components

  1. TVP00RW-11-19PD-P35AD
  2. 531AA133M000BGR
  3. LTC2222CUK-11#TR
  4. PLB3G820A02
  5. GMSM3-10P-8J1-18B
  6. SX50M470B2SV1325
  7. RBR71L22901QR
  8. 1825RB472K152NT
  9. 1.5SMC12CAT/R7
  10. BZM5236B_R1_10001
  11. A2541WV-33P
  12. 0201WMF1050TEE

Popular Articles

  1. In the post-Moore era, advanced packaging will usher in its highlight moment
  2. Mendix Intelligent Solutions Introduces Business Events and Enhances Artificial Intelligence and Machine Learning
  3. WPG World Peace Group launches digital car key solution based on NXP products
  4. Detailed wiring diagram of the tester
  5. Redmi Note 11 Pro+ passes FCC certification: will be released overseas
  6. Battery-powered Tektronix oscilloscope TPS2000B, please learn more about it
  7. 26-Simple temperature controlled fan based on single chip microcomputer
  8. Samsung's chip production cuts carbon emissions by nearly 700,000 metric tons in 2021
  9. Principle of clamp ammeter
  10. Microchip's analog embedded SuperFlash® technology helps storage and computing innovation companies

Technical ResourceMore

  1. Flash fan burning
  2. dxp2004, software download
  3. USB keyboard common code value table
  4. Parameters of more than 3,000 commonly used transistors and field effect tubes
  5. Design of low phase noise and low spurious frequency source based on HMC830
  6. Shielding Power Supply to Improve Precision Using isoPower Devices
  7. DC speed control device
  8. PDF Virtual Printer Installation Tutorial
  9. Design of precise positioning system for micro-motion array deployment
  10. Research on performance testing technology of electrostatic discharge protection devices

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 1685  343  2828  709  1198  34  7  57  15  25 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号