|
IRF543 |
IRF542 |
RACF102DFT33K2 |
| Description |
25A, 80V, 0.1ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB |
25A, 100V, 0.1ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB |
Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.063W, 33200ohm, 25V, 1% +/-Tol, 250ppm/Cel, Surface Mount, 0404, CHIP, ROHS COMPLIANT |
| Is it Rohs certified? |
incompatible |
incompatible |
conform to |
| Reach Compliance Code |
not_compliant |
not_compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
| JESD-609 code |
e0 |
e0 |
e3 |
| Number of components |
1 |
1 |
1 |
| Number of terminals |
3 |
3 |
4 |
| Maximum operating temperature |
175 °C |
175 °C |
155 °C |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR PACKAGE |
| Package form |
FLANGE MOUNT |
FLANGE MOUNT |
SMT |
| surface mount |
NO |
NO |
YES |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) - with Nickel (Ni) barrier |
| Maker |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
- |
| Avalanche Energy Efficiency Rating (Eas) |
230 mJ |
230 mJ |
- |
| Shell connection |
DRAIN |
DRAIN |
- |
| Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
- |
| Minimum drain-source breakdown voltage |
80 V |
100 V |
- |
| Maximum drain current (Abs) (ID) |
25 A |
25 A |
- |
| Maximum drain current (ID) |
25 A |
25 A |
- |
| Maximum drain-source on-resistance |
0.1 Ω |
0.1 Ω |
- |
| FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
- |
| JEDEC-95 code |
TO-220AB |
TO-220AB |
- |
| JESD-30 code |
R-PSFM-T3 |
R-PSFM-T3 |
- |
| Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
- |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
- |
| Maximum power consumption environment |
150 W |
150 W |
- |
| Maximum power dissipation(Abs) |
150 W |
150 W |
- |
| Maximum pulsed drain current (IDM) |
100 A |
100 A |
- |
| Certification status |
Not Qualified |
Not Qualified |
- |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
- |
| Terminal location |
SINGLE |
SINGLE |
- |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| transistor applications |
SWITCHING |
SWITCHING |
- |
| Transistor component materials |
SILICON |
SILICON |
- |
| Maximum off time (toff) |
135 ns |
135 ns |
- |
| Maximum opening time (tons) |
133 ns |
133 ns |
- |