|
MN5211H/B |
MN5211H/BCH |
| Description |
ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, DIP-24 |
ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, DIP-24 |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
Spectrum Microwave |
Spectrum Microwave |
| Parts packaging code |
DIP |
DIP |
| package instruction |
DIP, DIP24,.6 |
DIP, DIP24,.6 |
| Contacts |
24 |
24 |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
3A001.A.2.C |
3A001.A.2.C |
| Maximum analog input voltage |
5 V |
5 V |
| Minimum analog input voltage |
-5 V |
-5 V |
| Maximum conversion time |
13 µs |
13 µs |
| Converter type |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code |
R-XDIP-T24 |
R-XDIP-T24 |
| JESD-609 code |
e0 |
e0 |
| length |
31.75 mm |
31.75 mm |
| Maximum linear error (EL) |
0.0122% |
0.0122% |
| Nominal negative supply voltage |
-15 V |
-15 V |
| Number of analog input channels |
1 |
1 |
| Number of digits |
12 |
12 |
| Number of functions |
1 |
1 |
| Number of terminals |
24 |
24 |
| Maximum operating temperature |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
| Output bit code |
COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
| Output format |
SERIAL, PARALLEL, WORD |
SERIAL, PARALLEL, WORD |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
DIP |
DIP |
| Encapsulate equivalent code |
DIP24,.6 |
DIP24,.6 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
5,+-15 V |
5,+-15 V |
| Certification status |
Not Qualified |
Not Qualified |
| Filter level |
MIL-STD-883 Class B |
MIL-PRF-38534 Class H |
| Nominal supply voltage |
15 V |
15 V |
| surface mount |
NO |
NO |
| technology |
HYBRID |
HYBRID |
| Temperature level |
MILITARY |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
15.24 mm |
15.24 mm |