319535-003US datasheet, PDF - EEWORLD Datasheet

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319535-003US: DescriptionIntel Atom Processor; File Size697KB，73 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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Intel Atom Processor

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Intel

Atom™ Processor Z5xx

∆

Series

Datasheet

— For the Intel

Atom™ Processor Z560

∆

, Z550

∆

, Z540

∆

, Z530

∆

Z520

∆

, Z515

∆

, Z510

∆

, and Z500

∆

on 45 nm Process Technology

June 2010

Document Number:

319535-003US

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR

IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY

APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR

DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The

information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

by calling 1-800-548-4725, or by visiting

Intel's Web Site.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor

family, not across different processor families. See http://www.intel.com/products/processor_number for details.

Intel

Virtualization Technology (Intel

VT) requires a computer system with an enabled Intel

processor, BIOS, virtual machine

monitor (VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other benefits will vary

depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible

with all operating systems. Please check with your application vendor.

Hyper-Threading Technology requires a computer system with a processor supporting Hyper-Threading Technology and HT

Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software

you see. See http://www.intel.com/technology/hypertheading/ for more information including details on which processor supports

HT Technology.

Intel

, Intel

Atom

, Intel

Centrino

, Enhanced Intel SpeedStep

Technology, Intel

Virtualization Technology (Intel

VT),

Intel

Thermal Monitor, Intel

Streaming SIMD Extensions 2 and 3 (Intel® SSE2 and Intel® SSE3), Intel

Burst Performance

Technology (Intel

BPT), Intel

Hyper-Threading Technology (Intel

HT Technology), and the Intel logo are trademarks of Intel

Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

∆

Datasheet

Contents

Introduction ...................................................................................................... 7

1.1

1.2

1.3

1.4

2.1

2.2

2.3

2.4

2.5

2.6

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

3.11

3.12

3.13

4.1

4.2

4.3

5.1

Abstract ................................................................................................. 7

Major Features ....................................................................................... 7

Terminology ........................................................................................... 9

References ............................................................................................ 11

Clock Control and Low-Power States ........................................................ 13

2.1.1

Package/Core Low-Power State Descriptions ................................ 15

Dynamic Cache Sizing ............................................................................ 22

Enhanced Intel SpeedStep® Technology ................................................... 23

Enhanced Low-Power States .................................................................... 24

FSB Low Power Enhancements................................................................. 25

2.5.1

CMOS Front Side Bus ................................................................ 25

Intel® Burst Performance Technology (Intel® BPT) .................................. 26

FSB, GTLREF, and CMREF........................................................................ 27

Power and Ground Pins ........................................................................... 27

Decoupling Guidelines ............................................................................ 28

3.3.1

Decoupling ......................................................................... 28

3.3.2

FSB AGTL+ Decoupling .............................................................. 28

FSB Clock (BCLK[1:0]) and Processor Clocking .......................................... 28

Voltage Identification and Power Sequencing ............................................. 28

Catastrophic Thermal Protection .............................................................. 31

Reserved and Unused Pins ...................................................................... 31

FSB Frequency Select Signals (BSEL[2:0]) ................................................ 31

FSB Signal Groups ................................................................................. 31

CMOS Asynchronous Signals ................................................................... 33

Maximum Ratings .................................................................................. 33

Processor DC Specifications..................................................................... 34

AGTL+ FSB Specifications ....................................................................... 45

Package Mechanical Specifications ........................................................... 47

4.1.1

Processor Package Weight ......................................................... 47

Processor Pinout Assignment ................................................................... 49

Signal Description .................................................................................. 56

Thermal

5.1.1

5.1.2

5.1.3

Specifications ............................................................................ 68

Thermal Diode ......................................................................... 68

Intel® Thermal Monitor ............................................................. 70

Digital Thermal Sensor .............................................................. 72

Low Power Features .......................................................................................... 13

Electrical Specifications ..................................................................................... 27

Package Mechanical Specifications and Pin Information.......................................... 47

Thermal Specifications and Design Considerations ................................................ 65

Datasheet

5.1.4

5.1.5

Out of Specification Detection .................................................... 72

PROCHOT# Signal Pin ............................................................... 72

Figures

Figure

1. Thread Low-Power States ..................................................................... 14

2. Package Low-Power States ................................................................... 14

3. Deep Power Down Technology Entry Sequence ....................................... 20

4. Deep Power Down Technology Exit Sequence.......................................... 20

5. Exit Latency Table ............................................................................... 21

6. Active V

and I

Loadline..................................................................... 40

7. Deeper Sleep V

and I

Loadline ......................................................... 41

8. Package Mechanical Drawing ................................................................ 48

9. Pinout Diagram (Top View, Left Side)..................................................... 49

10. Pinout Diagram (Top View, Right Side) ................................................. 50

Tables

Table

References .......................................................................................... 11

Coordination of Thread Low-Power States at the Package/Core Level .......... 15

Voltage Identification Definition ............................................................. 29

BSEL[2:0] Encoding for BCLK Frequency ................................................. 31

FSB Pin Groups .................................................................................... 32

Processor Absolute Maximum Ratings ..................................................... 34

Voltage and Current Specifications for the Intel® Atom™ Processor Z560,

Z550, Z540, Z530, Z520, and Z510 ....................................................... 35

8. Voltage and Current Specifications for the Intel® Atom™ Processor Z500 ... 37

9. Voltage and Current Specifications for the Intel® Atom™ Processor Z515 ... 38

10. FSB Differential BCLK Specifications ...................................................... 42

11. AGTL+/CMOS Signal Group DC Specifications ......................................... 43

12. Legacy CMOS Signal Group DC Specifications ......................................... 44

13. Open Drain Signal Group DC Specifications ............................................ 44

14. Pinout Arranged by Signal Name .......................................................... 51

15. Signal Description ............................................................................... 56

16. Power Specifications for Intel® Atom™ Processors Z560, Z550, Z540,

Z530, Z520, and Z510 ........................................................................ 66

17. Power Specifications for Intel

Atom™ Processors Z515 and Z500 ............ 67

18. Thermal Diode Interface ...................................................................... 69

19. Thermal Diode Parameters Using Transistor Model .................................. 69

Datasheet

319535-003US Related Products

	319535-003US	Z510	Z500	Z515	Z530	Z540	Z520	Z560	Z550	Z5XX
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