Intel
®
Atom™ Processor Z5xx
∆
Series
Datasheet
— For the Intel
®
Atom™ Processor Z560
∆
, Z550
∆
, Z540
∆
, Z530
∆
,
Z520
∆
, Z515
∆
, Z510
∆
, and Z500
∆
on 45 nm Process Technology
June 2010
Document Number:
319535-003US
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definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The
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®
Virtualization Technology (Intel
®
VT) requires a computer system with an enabled Intel
®
processor, BIOS, virtual machine
monitor (VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other benefits will vary
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you see. See http://www.intel.com/technology/hypertheading/ for more information including details on which processor supports
HT Technology.
Intel
®
, Intel
®
Atom
TM
, Intel
®
Centrino
®
, Enhanced Intel SpeedStep
®
Technology, Intel
®
Virtualization Technology (Intel
®
VT),
Intel
®
Thermal Monitor, Intel
®
Streaming SIMD Extensions 2 and 3 (Intel® SSE2 and Intel® SSE3), Intel
®
Burst Performance
Technology (Intel
®
BPT), Intel
®
Hyper-Threading Technology (Intel
®
HT Technology), and the Intel logo are trademarks of Intel
Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007–2010 Intel Corporation. All rights reserved.
∆
2
Datasheet
Contents
1
Introduction ...................................................................................................... 7
1.1
1.2
1.3
1.4
2
2.1
2.2
2.3
2.4
2.5
2.6
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
4
4.1
4.2
4.3
5
5.1
Abstract ................................................................................................. 7
Major Features ....................................................................................... 7
Terminology ........................................................................................... 9
References ............................................................................................ 11
Clock Control and Low-Power States ........................................................ 13
2.1.1
Package/Core Low-Power State Descriptions ................................ 15
Dynamic Cache Sizing ............................................................................ 22
Enhanced Intel SpeedStep® Technology ................................................... 23
Enhanced Low-Power States .................................................................... 24
FSB Low Power Enhancements................................................................. 25
2.5.1
CMOS Front Side Bus ................................................................ 25
Intel® Burst Performance Technology (Intel® BPT) .................................. 26
FSB, GTLREF, and CMREF........................................................................ 27
Power and Ground Pins ........................................................................... 27
Decoupling Guidelines ............................................................................ 28
3.3.1
V
CC
Decoupling ......................................................................... 28
3.3.2
FSB AGTL+ Decoupling .............................................................. 28
FSB Clock (BCLK[1:0]) and Processor Clocking .......................................... 28
Voltage Identification and Power Sequencing ............................................. 28
Catastrophic Thermal Protection .............................................................. 31
Reserved and Unused Pins ...................................................................... 31
FSB Frequency Select Signals (BSEL[2:0]) ................................................ 31
FSB Signal Groups ................................................................................. 31
CMOS Asynchronous Signals ................................................................... 33
Maximum Ratings .................................................................................. 33
Processor DC Specifications..................................................................... 34
AGTL+ FSB Specifications ....................................................................... 45
Package Mechanical Specifications ........................................................... 47
4.1.1
Processor Package Weight ......................................................... 47
Processor Pinout Assignment ................................................................... 49
Signal Description .................................................................................. 56
Thermal
5.1.1
5.1.2
5.1.3
Specifications ............................................................................ 68
Thermal Diode ......................................................................... 68
Intel® Thermal Monitor ............................................................. 70
Digital Thermal Sensor .............................................................. 72
3
Low Power Features .......................................................................................... 13
Electrical Specifications ..................................................................................... 27
Package Mechanical Specifications and Pin Information.......................................... 47
Thermal Specifications and Design Considerations ................................................ 65
Datasheet
5.1.4
5.1.5
Out of Specification Detection .................................................... 72
PROCHOT# Signal Pin ............................................................... 72
Figures
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
1. Thread Low-Power States ..................................................................... 14
2. Package Low-Power States ................................................................... 14
3. Deep Power Down Technology Entry Sequence ....................................... 20
4. Deep Power Down Technology Exit Sequence.......................................... 20
5. Exit Latency Table ............................................................................... 21
6. Active V
cc
and I
cc
Loadline..................................................................... 40
7. Deeper Sleep V
CC
and I
CC
Loadline ......................................................... 41
8. Package Mechanical Drawing ................................................................ 48
9. Pinout Diagram (Top View, Left Side)..................................................... 49
10. Pinout Diagram (Top View, Right Side) ................................................. 50
Tables
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
1.
2.
3.
4.
5.
6.
7.
References .......................................................................................... 11
Coordination of Thread Low-Power States at the Package/Core Level .......... 15
Voltage Identification Definition ............................................................. 29
BSEL[2:0] Encoding for BCLK Frequency ................................................. 31
FSB Pin Groups .................................................................................... 32
Processor Absolute Maximum Ratings ..................................................... 34
Voltage and Current Specifications for the Intel® Atom™ Processor Z560,
Z550, Z540, Z530, Z520, and Z510 ....................................................... 35
8. Voltage and Current Specifications for the Intel® Atom™ Processor Z500 ... 37
9. Voltage and Current Specifications for the Intel® Atom™ Processor Z515 ... 38
10. FSB Differential BCLK Specifications ...................................................... 42
11. AGTL+/CMOS Signal Group DC Specifications ......................................... 43
12. Legacy CMOS Signal Group DC Specifications ......................................... 44
13. Open Drain Signal Group DC Specifications ............................................ 44
14. Pinout Arranged by Signal Name .......................................................... 51
15. Signal Description ............................................................................... 56
16. Power Specifications for Intel® Atom™ Processors Z560, Z550, Z540,
Z530, Z520, and Z510 ........................................................................ 66
17. Power Specifications for Intel
®
Atom™ Processors Z515 and Z500 ............ 67
18. Thermal Diode Interface ...................................................................... 69
19. Thermal Diode Parameters Using Transistor Model .................................. 69
4
Datasheet
Revision History
Document
Number
319535
319535
Revision
Number
001
002
•
Initial release
•
Updated information about Intel
®
Atom processors
Z515 and Z550.
•
Added Intel
®
Atom processor Z550 specifications to
Table 7
•
Changed VccBoot value to VccLFM in Table 7 and
Table 8.
•
Added new Table 9, Voltage and Current
Specifications for Intel
®
Atom processor Z515.
•
Removed EMTTM references as it is not a supported
feature.
319535
003
•
Added Z560 information
•
Defeatured and removed mention of C6 Split V
TT
June 2010
Description
Revision Date
April 2008
March 2009
§
Datasheet
5
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