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MM3Z6V8STG

Description
26.86 V, 0.2 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE
Categorysemiconductor    Discrete semiconductor   
File Size98KB,4 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric View All

MM3Z6V8STG Overview

26.86 V, 0.2 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE

MM3Z6V8STG Parametric

Parameter NameAttribute value
Number of components1
Number of terminals2
Processing package descriptionHALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 477-02, 2 PIN
each_compliYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateActive
Diode typeZENER DIODE
structureSINGLE
Diode component materialsSILICON
dynamic_impedance_max80 ohm
jesd_30_codeR-PDSO-G2
jesd_609_codee3
moisture_sensitivity_levelNOT SPECIFIED
Minimum operating temperature-65 Cel
Maximum operating temperature150 Cel
Packaging MaterialsPLASTIC/EPOXY
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
eak_reflow_temperature__cel_NOT SPECIFIED
polarityUNIDIRECTIONAL
wer_dissipation_max0.2000 W
qualification_statusCOMMERCIAL
eference_voltage_nom26.86 V
sub_categoryVoltage Reference Diodes
surface mountYES
CraftsmanshipZENER
terminal coatingMATTE TIN
Terminal formGULL WING
Terminal locationDUAL
ime_peak_reflow_temperature_max__s_NOT SPECIFIED
voltage_tol_max2.49 %
Working test current5 mA
MM3Z2V4ST1 SERIES
Zener Voltage Regulators
200 mW SOD−323 Surface Mount
Tight Tolerance Portfolio
This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 200 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand−held portables,
and high density PC boards.
Specification Features:
http://onsemi.com
1
Cathode
2
Anode
Standard Zener Breakdown Voltage Range
2
1
SOD−323
CASE 477
STYLE 1
MARKING
DIAGRAM
XXMG
G
2.4 V to 33 V
Steady State Power Rating of 200 mW
Small Body Outline Dimensions:
0.067″ x 0.049″ (1.7 mm x 1.25 mm)
Low Body Height: 0.035″ (0.9 mm)
Package Weight: 4.507 mg/unit
ESD Rating of Class 3 (>16 kV) per Human Body Model
Tight Tolerance V
Z
Pb−Free Packages are Available
XX = Specific Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary
depending upon manufacturing location.
Mechanical Characteristics:
CASE:
Void-free, transfer-molded plastic
FINISH:
All external surfaces are corrosion resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
ORDERING INFORMATION
Device
MM3ZxxxST1
MM3ZxxxST1G
MM3ZxxxST3
MM3ZxxxST3G
Package
SOD−323
SOD−323
(Pb−Free)
SOD−323
SOD−323
(Pb−Free)
Shipping
3000/Tape & Reel
3000/Tape & Reel
10,000/Tape & Reel
10,000/Tape & Reel
260°C for 10 Seconds
LEADS:
Plated with Pb−Sn or Sn only (Pb−Free)
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MOUNTING POSITION:
Any
MAXIMUM RATINGS
Rating
Total Device Dissipation FR−5 Board,
(Note 1) @ T
A
= 25°C
Derate above 25°C
Thermal Resistance from
Junction−to−Ambient
Junction and Storage
Temperature Range
Symbol
P
D
Max
200
1.5
635
−65
to +150
Unit
mW
mW/°C
°C/W
°C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
R
qJA
T
J
, T
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
©
Semiconductor Components Industries, LLC, 2008
September, 2008
Rev. 15
1
Publication Order Number:
MM3Z2V4ST1/D

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