Field Programmable Gate Array, TTL, PDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| Number of terminals | 28 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| AM29LPL141PC | AM29LPL141DC | AM29LPL141DCB | AM29LPL141PCB | AM29PL141/B3A | AM29PL141PC | |
|---|---|---|---|---|---|---|
| Description | Field Programmable Gate Array, TTL, PDIP28 | Field Programmable Gate Array, TTL, CDIP28 | Field Programmable Gate Array, TTL, CDIP28 | Field Programmable Gate Array, TTL, PDIP28 | Field Programmable Gate Array, TTL, CQCC28 | Field Programmable Gate Array, TTL, PDIP28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD | AMD | AMD |
| package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCN, LCC28,.45SQ | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | S-XQCC-N28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC |
| encapsulated code | DIP | DIP | DIP | DIP | QCCN | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | LCC28,.45SQ | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
| surface mount | NO | NO | NO | NO | YES | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
| Certification status | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
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