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AM29LPL141DCB

Description
Field Programmable Gate Array, TTL, CDIP28
CategoryProgrammable logic devices    Programmable logic   
File Size1MB,26 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

AM29LPL141DCB Overview

Field Programmable Gate Array, TTL, CDIP28

AM29LPL141DCB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
package instructionDIP, DIP28,.6
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T28
JESD-609 codee0
Number of terminals28
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

AM29LPL141DCB Related Products

AM29LPL141DCB AM29LPL141DC AM29LPL141PC AM29LPL141PCB AM29PL141/B3A AM29PL141PC
Description Field Programmable Gate Array, TTL, CDIP28 Field Programmable Gate Array, TTL, CDIP28 Field Programmable Gate Array, TTL, PDIP28 Field Programmable Gate Array, TTL, PDIP28 Field Programmable Gate Array, TTL, CQCC28 Field Programmable Gate Array, TTL, PDIP28
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker AMD AMD AMD AMD AMD AMD
package instruction DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 QCCN, LCC28,.45SQ DIP, DIP28,.6
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T28 R-XDIP-T28 R-PDIP-T28 R-PDIP-T28 S-XQCC-N28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0
Number of terminals 28 28 28 28 28 28
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 125 °C 70 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC PLASTIC
encapsulated code DIP DIP DIP DIP QCCN DIP
Encapsulate equivalent code DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 LCC28,.45SQ DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER IN-LINE
Programmable logic type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
surface mount NO NO NO NO YES NO
technology TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL QUAD DUAL
Certification status - Not Qualified Not Qualified - Not Qualified Not Qualified
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