IC,BUFFER/DRIVER,SINGLE,10-BIT,F-TTL,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| Maker | AMD |
| package instruction | , |
| Reach Compliance Code | unknow |
| Base Number Matches | 1 |
| AM29827ADM/B | AM29827ADMB | AM29827PCB | AM29828ADMB | AM29828PCB | 5962-01-354-1882 | 5962-01-354-1893 | |
|---|---|---|---|---|---|---|---|
| Description | IC,BUFFER/DRIVER,SINGLE,10-BIT,F-TTL,DIP,24PIN,CERAMIC | Bus Driver, 1-Func, 10-Bit, True Output, TTL, CDIP24, | Bus Driver, 1-Func, 10-Bit, True Output, TTL, PDIP24 | Bus Driver, 1-Func, 10-Bit, Inverted Output, TTL, CDIP24, | Bus Driver, 1-Func, 10-Bit, Inverted Output, TTL, PDIP24 | Bus Driver, 1-Func, 10-Bit, Inverted Output, TTL, PDIP24 | Bus Driver, 1-Func, 10-Bit, True Output, TTL, PDIP24 |
| package instruction | , | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | compliant | compliant |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Control type | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 code | - | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
| JESD-609 code | - | e0 | e0 | e0 | e0 | - | - |
| Logic integrated circuit type | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | - | 0.032 A | 0.048 A | 0.032 A | 0.048 A | 0.048 A | 0.048 A |
| Number of digits | - | 10 | 10 | 10 | 10 | 10 | 10 |
| Number of functions | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | - | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | - | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | - | TRUE | TRUE | INVERTED | INVERTED | INVERTED | TRUE |
| Package body material | - | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | - | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | - | 80 mA | 80 mA | 80 mA | 80 mA | 80 mA | 80 mA |
| Prop。Delay @ Nom-Su | - | 13 ns | 23 ns | 13 ns | 23 ns | - | - |
| Certification status | - | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | NO | NO | NO | NO | NO | NO |
| technology | - | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | - | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |