EEWORLDEEWORLDEEWORLD

Part Number

Search

BSS138LT1D

Description
200mA, 50V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB
Categorysemiconductor    Discrete semiconductor   
File Size69KB,6 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric Compare View All

BSS138LT1D Overview

200mA, 50V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB

BSS138LT1D Parametric

Parameter NameAttribute value
Number of terminals3
Minimum breakdown voltage50 V
Processing package descriptionCASE 318-08, 3 PIN
stateTRANSFERRED
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
structureSINGLE WITH BUILT-IN DIODE
Number of components1
transistor applicationsSWITCHING
Transistor component materialsSILICON
Maximum ambient power consumption0.2250 W
Channel typeN-CHANNEL
field effect transistor technologyMETAL-OXIDE SEMICONDUCTOR
operating modeENHANCEMENT
Transistor typeGENERAL PURPOSE SMALL SIGNAL
Maximum leakage current0.2000 A
feedback capacitor5 pF
Maximum drain on-resistance3.5 ohm
BSS138L, BVSS138L
Power MOSFET
200 mA, 50 V
N−Channel SOT−23
Typical applications are DC−DC converters, power management in
portable and battery−powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
Features
www.onsemi.com
Low Threshold Voltage (V
GS(th)
: 0.85 V−1.5 V) Makes it Ideal for
Low Voltage Applications
Miniature SOT−23 Surface Mount Package Saves Board Space
BVSS Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current
− Continuous @ T
A
= 25°C
− Pulsed Drain Current (t
p
10
ms)
Total Power Dissipation @ T
A
= 25°C
Operating and Storage Temperature
Range
Thermal Resistance,
Junction−to−Ambient
Maximum Lead Temperature for
Soldering Purposes, for 10 seconds
Symbol
V
DSS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
qJA
T
L
Value
50
±
20
200
800
225
− 55 to 150
556
260
mW
°C
°C/W
°C
Unit
Vdc
Vdc
mA
1
2
200 mA, 50 V
R
DS(on)
= 3.5
W
N−Channel
3
1
2
3
MARKING
DIAGRAM
SOT−23
CASE 318
STYLE 21
J1 MG
G
1
J1
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
Device
BSS138LT1G
BVSS138LT1G
BSS138LT3G
BVSS138LT3G
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
3000 / Tape & Reel
3000 / Tape & Reel
10,000 / Tape & Reel
10,000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2016
1
January, 2018 − Rev. 11
Publication Order Number:
BSS138LT1/D

BSS138LT1D Related Products

BSS138LT1D BSS138LT1_09
Description 200mA, 50V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB 200mA, 50V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB
Number of terminals 3 3
Minimum breakdown voltage 50 V 50 V
Processing package description CASE 318-08, 3 PIN CASE 318-08, 3 PIN
state TRANSFERRED TRANSFERRED
packaging shape RECTANGULAR RECTANGULAR
Package Size SMALL OUTLINE SMALL OUTLINE
surface mount Yes Yes
Terminal form GULL WING GULL WING
Terminal location DUAL DUAL
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY
structure SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Number of components 1 1
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON
Maximum ambient power consumption 0.2250 W 0.2250 W
Channel type N-CHANNEL N-CHANNEL
field effect transistor technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
operating mode ENHANCEMENT ENHANCEMENT
Transistor type GENERAL PURPOSE SMALL SIGNAL GENERAL PURPOSE SMALL SIGNAL
Maximum leakage current 0.2000 A 0.2000 A
feedback capacitor 5 pF 5 pF
Maximum drain on-resistance 3.5 ohm 3.5 ohm

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2114  771  2255  222  938  43  16  46  5  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号