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BZX84CXXXLT1G

Description
2.4 V, 0.225 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB
Categorysemiconductor    Discrete semiconductor   
File Size167KB,7 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric View All

BZX84CXXXLT1G Overview

2.4 V, 0.225 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB

BZX84CXXXLT1G Parametric

Parameter NameAttribute value
Number of terminals3
Number of components1
Rated working voltage2.4 V
Processing package descriptionPLASTIC, CASE 318-07, 3 PIN
stateTRANSFERRED
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
CraftsmanshipZENER
structureSINGLE
Diode component materialsSILICON
Maximum power consumption limit0.2250 W
polarityUNIDIRECTIONAL
Diode typeVOLTAGE REGULATOR DIODE
Working test current5 mA
Maximum total reference voltage8.33 %
BZX84B4V7LT1,
BZX84C2V4LT1 Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Features
http://onsemi.com
3
Cathode
1
Anode
225 mW Rating on FR−4 or FR−5 Board
Zener Breakdown Voltage Range
2.4 V to 75 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 KV) per Human Body Model
Tight Tolerance Series Available (See Page 4)
Pb−Free Packages are Available
MARKING
DIAGRAM
3
1
2
SOT−23
CASE 318
STYLE 8
1
xxx M
G
G
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Total Power Dissipation on FR−5 Board,
(Note 1) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina
Substrate, (Note 2) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Symbol
P
D
R
qJA
P
D
R
qJA
T
J
, T
stg
Max
225
1.8
556
300
2.4
417
−65
to
+150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
xxx
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
* Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
BZX84CxxxLT1
BZX84CxxxLT1G
BZX84CxxxLT3
BZX84CxxxLT3G
BZX84BxxxLT1
BZX84BxxxLT1G
BZX84BxxxLT3
BZX84BxxxLT3G
Package
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
Shipping
3000/Tape & Reel
3000/Tape & Reel
10,000/Tape & Reel
10,000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
10,000/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 X 0.75 X 0.62 in.
2. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.
SOT−23 10,000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2009
July, 2009
Rev. 13
1
Publication Order Number:
BZX84C2V4LT1/D
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