
Power Bipolar Transistor, 6A I(C), 400V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | conform to |
| Maker | CDIL[Continental Device India Pvt. Ltd.] |
| package instruction | FLANGE MOUNT, O-MBFM-P2 |
| Reach Compliance Code | compliant |
| Shell connection | COLLECTOR |
| Maximum collector current (IC) | 6 A |
| Collector-emitter maximum voltage | 400 V |
| Configuration | SINGLE |
| Minimum DC current gain (hFE) | 30 |
| JEDEC-95 code | TO-3 |
| JESD-30 code | O-MBFM-P2 |
| Number of components | 1 |
| Number of terminals | 2 |
| Maximum operating temperature | 200 °C |
| Package body material | METAL |
| Package shape | ROUND |
| Package form | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | NPN |
| Maximum power consumption environment | 75 W |
| Maximum power dissipation(Abs) | 75 W |
| Certification status | Not Qualified |
| surface mount | NO |
| Terminal form | PIN/PEG |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Transistor component materials | SILICON |
| Nominal transition frequency (fT) | 6 MHz |
| VCEsat-Max | 3 V |

| BU326A | 2SD1168P | 2SD1168Q | 2SD870 | 2SD871 | BU208A | BU208 | |
|---|---|---|---|---|---|---|---|
| Description | Power Bipolar Transistor, 6A I(C), 400V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin | Power Bipolar Transistor, 5A I(C), 800V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin | Power Bipolar Transistor, 5A I(C), 800V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin | Power Bipolar Transistor, 5A I(C), 600V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin | Power Bipolar Transistor, 6A I(C), 600V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin | Power Bipolar Transistor, 5A I(C), 700V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin | Power Bipolar Transistor, 5A I(C), 700V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin |
| Is it Rohs certified? | conform to | incompatible | incompatible | incompatible | incompatible | conform to | conform to |
| Reach Compliance Code | compliant | compli | compli | compli | compli | compliant | compliant |
| Shell connection | COLLECTOR | COLLECTOR | COLLECTOR | COLLECTOR | COLLECTOR | COLLECTOR | COLLECTOR |
| Maximum collector current (IC) | 6 A | 5 A | 5 A | 5 A | 6 A | 5 A | 5 A |
| Collector-emitter maximum voltage | 400 V | 800 V | 800 V | 600 V | 600 V | 700 V | 700 V |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Minimum DC current gain (hFE) | 30 | 9 | 15 | 8 | 8 | 2.5 | 2.25 |
| JEDEC-95 code | TO-3 | TO-3 | TO-3 | TO-3 | TO-3 | TO-3 | TO-3 |
| JESD-30 code | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Package body material | METAL | METAL | METAL | METAL | METAL | METAL | METAL |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
| Polarity/channel type | NPN | NPN | NPN | NPN | NPN | NPN | NPN |
| Maximum power consumption environment | 75 W | 50 W | 50 W | 50 W | 50 W | 80 W | 13 W |
| Maximum power dissipation(Abs) | 75 W | 50 W | 50 W | 50 W | 50 W | 13 W | 12.5 W |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| VCEsat-Max | 3 V | 1 V | 1 V | 5 V | 5 V | 5 V | 5 V |
| Is it lead-free? | Contains lead | - | - | Contains lead | Contains lead | Contains lead | Contains lead |
| package instruction | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 | - |
| Maximum operating temperature | 200 °C | - | - | 140 °C | 140 °C | 115 °C | 115 °C |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Nominal transition frequency (fT) | 6 MHz | - | - | 4 MHz | 3 MHz | 4 MHz | 4 MHz |
| JESD-609 code | - | e0 | e0 | e0 | e0 | - | - |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - |