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AM27HB010-60V05JC

Description
OTP ROM, 128KX8, 60ns, CMOS, PQCC32, PLASTIC, LCC-32
Categorystorage    storage   
File Size446KB,15 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

AM27HB010-60V05JC Overview

OTP ROM, 128KX8, 60ns, CMOS, PQCC32, PLASTIC, LCC-32

AM27HB010-60V05JC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeQFJ
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time60 ns
I/O typeCOMMON
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.97 mm
memory density1048576 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3.556 mm
Maximum standby current0.001 A
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm

AM27HB010-60V05JC Related Products

AM27HB010-60V05JC AM27HB010-50V05DCB AM27HB010-60V05PC AM27HB010-50V05DC AM27HB010-50V05LC AM27HB010-50V05LCB
Description OTP ROM, 128KX8, 60ns, CMOS, PQCC32, PLASTIC, LCC-32 UVPROM, 128KX8, 50ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 OTP ROM, 128KX8, 60ns, CMOS, PDIP32, PLASTIC, DIP-32 UVPROM, 128KX8, 50ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 UVPROM, 128KX8, 50ns, CMOS, CQCC32, CERAMIC, LCC-32 UVPROM, 128KX8, 50ns, CMOS, CQCC32, CERAMIC, LCC-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker AMD AMD AMD AMD AMD AMD
Parts packaging code QFJ DIP DIP DIP QFJ QFJ
package instruction QCCJ, LDCC32,.5X.6 WDIP, DIP32,.6 DIP, DIP32,.6 WDIP, DIP32,.6 WQCCN, LCC32,.45X.55 WQCCN, LCC32,.45X.55
Contacts 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 60 ns 50 ns 60 ns 50 ns 50 ns 50 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PQCC-J32 R-GDIP-T32 R-PDIP-T32 R-GDIP-T32 R-CQCC-N32 R-CQCC-N32
JESD-609 code e0 e0 e0 e0 e0 e0
length 13.97 mm 42.1005 mm 42.164 mm 42.1005 mm 13.97 mm 13.97 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type OTP ROM UVPROM OTP ROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCJ WDIP DIP WDIP WQCCN WQCCN
Encapsulate equivalent code LDCC32,.5X.6 DIP32,.6 DIP32,.6 DIP32,.6 LCC32,.45X.55 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE, WINDOW IN-LINE IN-LINE, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.556 mm 5.588 mm 5.715 mm 5.588 mm 3.556 mm 3.556 mm
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.1 mA 0.1 mA 0.1 mA 0.1 mA 0.1 mA 0.1 mA
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location QUAD DUAL DUAL DUAL QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.43 mm 15.24 mm 15.24 mm 15.24 mm 11.43 mm 11.43 mm
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